Digitizer and method of manufacturing the same

Abstract

A method of manufacturing a digitizer includes forming a circuit layer that detects an input, forming a magnetic field shielding layer that contains disoriented magnetic powder, disposing an adhesive between the circuit layer and the magnetic field shielding layer, and hot pressing the circuit layer and the magnetic field shielding layer so as to orient the magnetic powder.

What is claimed is: 
     
         1 . A method of manufacturing a digitizer, the method comprising:
 forming a circuit layer configured for sensing or detecting an input;   forming a magnetic field shielding layer that includes disoriented magnetic powder;   disposing an adhesive between the circuit layer and the magnetic field shielding layer; and   hot pressing the circuit layer and the magnetic field shielding layer so as to orient the magnetic powder.   
     
     
         2 . The method of  claim 1 , wherein the forming of the circuit layer further comprises:
 providing a Copper Clad Laminate (CCL) comprising an insulating layer, a first conductive layer, and a second conductive layer; and   etching the first and second conductive layers to form first and second circuits, respectively.   
     
     
         3 . The method of  claim 2 , further comprising forming a cover layer on a surface of the first circuit. 
     
     
         4 . The method of  claim 1 , wherein the forming of the magnetic field shielding layer further comprises:
 dispersing magnetic powder in a resin; and   coating the resin in which the magnetic powder is dispersed on a surface of a cover layer disposed between the circuit layer and the magnetic field shielding layer.   
     
     
         5 . The method of  claim 4 , wherein the forming of the magnetic field shielding layer further comprises transforming the magnetic powder into flakes, and wherein the transformed magnetic powder is dispersed in the resin. 
     
     
         6 . The method of  claim 1 , further comprising attaching a conductive layer to a surface of the magnetic field shielding layer. 
     
     
         7 . The method of  claim 6 , wherein the conductive layer is attached to the magnetic field shielding layer by using an adhesive. 
     
     
         8 . The method of  claim 1 , further comprising:
 disposing a cover layer between the circuit layer and the magnetic field shielding layer; and   using the adhesive to attach the cover layer and the circuit layer to each other.   
     
     
         9 . The method of  claim 1 , wherein the adhesive is a pressure sensitive adhesive or a thermosetting adhesive. 
     
     
         10 . A digitizer manufactured using the method of  claim 1 . 
     
     
         11 . A digitizer comprising:
 a circuit layer that detects or senses an input;   a magnetic field shielding layer disposed on the circuit layer and including magnetic powder having an oriented magnetic field; and   a conductive layer disposed on the magnetic field shielding layer.   
     
     
         12 . The digitizer of  claim 11 , wherein the circuit layer further comprises:
 an insulating layer; and   first and second circuit patterns disposed on opposite sides of the insulating layer.   
     
     
         13 . The digitizer of  claim 11 , further comprising first and second cover layers disposed on opposite sides of the circuit layer. 
     
     
         14 . The digitizer of  claim 12 , wherein the circuit layer further comprises:
 a Copper Clad Laminate (CCL) comprising an insulating layer, a first conductive layer, and a conductive insulating layer; and the first and second conductive layers are etched to form the first and second circuit patterns.   
     
     
         15 . The digitizer of  claim 11 , wherein the magnetic field shielding layer is fabricated by dispersing a disoriented magnetic powder in a resin; and coating the resin in which the magnetic powder is dispersed on a surface of a cover layer disposed between the circuit layer and the magnetic field shielding layer. 
     
     
         16 . The digitizer of  claim 15 , wherein the magnetic field shielding layer is fabricated by transforming the disoriented magnetic powder into flakes, such that the transformed disoriented magnetic powder is dispersed in the resin. 
     
     
         17 . The digitizer of  claim 11 , wherein the conductive layer is attached to the magnetic field shielding layer by an adhesive. 
     
     
         18 . The digitizer of  claim 13 , wherein an adhesive is used to attach the second cover layer and the circuit layer to each other. 
     
     
         19 . The digitizer of  claim 17 , wherein the adhesive is a pressure sensitive adhesive or a thermosetting adhesive. 
     
     
         20 . The digitizer of  claim 18 , wherein the adhesive is a pressure sensitive adhesive or a thermosetting adhesive.