Semiconductor device

Abstract

Conventional semiconductor devices have a problem that it is difficult to prevent the short circuit between chips and to improve accuracy in temperature detection with the controlling semiconductor chips. In a semiconductor device of the present invention, a first mount region to which a driving semiconductor chip is fixedly attached and a second mount region to which a controlling semiconductor chip is fixedly attached are formed isolated from each other. A projecting area is formed in the first mount region, and the projecting area protrudes into the second mount region. The controlling semiconductor chip is fixedly attached to the top surfaces of the projecting area and the second mount region by use of an insulating adhesive sheet material. This structure prevents the short circuit between the two chips, and improves accuracy in temperature detection with the controlling semiconductor chip.

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         7 . A semiconductor device comprising:
 at least a mount region;   leads placed near the mount region;   a first semiconductor chip fixedly attached to a top surface of the mount region;   a sheet material comprising an insulating adhesive applied to a top side of the sheet material, wherein the sheet material is adhered by the insulating adhesive to a back surface of the mount region in a way that closes an opening formed in the mount region;   a second semiconductor chip fixedly attached to the top side of the sheet material inside the opening by the insulating adhesive, wherein the second semiconductor chip is configured to control the first semiconductor chip; and   a resin sealing body covering at least part of the mount region, the leads, and the first and second semiconductor chips.   
     
     
         8 . The semiconductor device according to  claim 7 , wherein the second semiconductor chip includes a thermal shutdown circuit configured to detect and control a temperature of the first semiconductor chip. 
     
     
         9 . The semiconductor device according to  claim 8 , wherein the sheet material comprises any one of a polyimide tape, a silicone tape and a DAF material. 
     
     
         10 . The semiconductor device according to  claim 9 , wherein the second semiconductor chip is placed on a portion of the sheet material, the portion being away from an end portion of the opening. 
     
     
         11 . The semiconductor device according to  claim 7 , wherein the second semiconductor chip has a footprint that is smaller than the opening formed in the mount region. 
     
     
         12 . The semiconductor device according to  claim 7 , wherein the sheet material comprises a polyimide tape. 
     
     
         13 . The semiconductor device according to  claim 7 , wherein the first semiconductor chip is wire bonded to the second semiconductor chip. 
     
     
         14 . The semiconductor device according to  claim 7 , wherein the opening formed in the mount region is enclosed by the mount region. 
     
     
         15 . The semiconductor device according to  claim 7 , wherein the first semiconductor chip is spaced apart from the mount region. 
     
     
         16 . A semiconductor device comprising:
 a lead frame;   an opening in the lead frame;   a plurality of leads extending from the lead frame;   an insulating adhesive sheet fixed to a first side of the lead frame, wherein a portion of the adhesive sheet extends over the opening in the lead frame;   a first semiconductor chip fixed to the portion of the insulating adhesive sheet extending over the opening in the lead frame, wherein the first semiconductor chip extends from the insulating adhesive sheet through the opening in the lead frame; and   an encapsulating resin at least partially encapsulating the first semiconductor chip, the insulating adhesive sheet, and the lead frame.   
     
     
         17 . The semiconductor device of  claim 16 , wherein the opening in the lead frame has a polygonal shape. 
     
     
         18 . The semiconductor device of  claim 17 , wherein the first semiconductor chip has a footprint with a polygonal shape that is the same as the polygonal shape of the lead frame. 
     
     
         19 . The semiconductor device of  claim 16 , wherein the first semiconductor chip is electrically coupled to one or more of the plurality of leads. 
     
     
         20 . The semiconductor device of  claim 16 , wherein the insulating adhesive sheet covers an entire surface area of the opening in the lead frame. 
     
     
         21 . The semiconductor device of  claim 16 , wherein the first semiconductor chip is spaced apart from the lead frame. 
     
     
         22 . The semiconductor device of  claim 16 , wherein the insulating adhesive sheet material is formed of any one of a polyimide tape, a silicone tape and a DAF material. 
     
     
         23 . The semiconductor device of  claim 16 , wherein the semiconductor device further comprises a second semiconductor chip fixed to a second side of the lead frame and spaced apart from the opening in the lead frame. 
     
     
         24 . The semiconductor device of  claim 23 , wherein the first semiconductor chip includes a thermal shutdown circuit configured to detect and control a temperature of the second semiconductor chip. 
     
     
         25 . The semiconductor device of  claim 16 , wherein the first semiconductor chip is laterally aligned over a center of the opening and spaced apart from each edge of the opening in the lead frame. 
     
     
         26 . A method of making a semiconductor device, the method comprising:
 providing a lead frame comprising:
 a plurality of leads extending from the lead frame; and 
 an opening extending through the lead frame from a first side of the lead frame to a second side of the lead frame; 
   fixing an insulating adhesive sheet to a second side of the lead frame, wherein the insulating adhesive sheet extends over the opening in the lead frame;   disposing a semiconductor chip through the opening in the lead frame such that the semiconductor chip adheres to the insulating adhesive sheet; and   embedding at least a portion of the lead frame, the semiconductor chip, and the adhesive sheet in an encapsulating resin.