Devices, systems and methods of cooling the skin

Abstract

According to some embodiments, a thermal conditioning system for selectively cooling skin of a subject comprises at least one thermal conditioning device comprising a first side and second side, the second side being generally opposite of the first side. In some embodiments, the system further comprises a heat sink positioned along the second side of the at least one thermal conditioning device, wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface.

1 - 35 . (canceled) 
     
     
         36 . A thermal conditioning system for selectively cooling or heating a skin surface of a subject, the system comprising:
 at least one thermal conditioning device comprising a first side and second side, the second side being generally opposite of the first side;   a heat sink positioned along the second side of the at least one thermal conditioning device;   wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface.   
     
     
         37 . The system of  claim 36 ,
 wherein the heat sink comprises one or more heat transfer members, the heat transfer members comprising fins or pins;   wherein the at least one thermal conditioning device comprises a thermoelectric device;   wherein the first side of the at least one thermal conditioning device is configured to not contact the skin surface; and   further comprising at least one spacer configured to maintain a clearance between the first side of the at least one thermal conditioning device and the skin surface of the subject during use.   
     
     
         38 . The system of  claim 36 , wherein the heat sink comprises one or more heat transfer members. 
     
     
         39 . The system of  claim 36 , wherein the heat transfer members comprise fins or pins. 
     
     
         40 . The system of  claim 36 , wherein the at least one thermal conditioning device comprises a thermoelectric device. 
     
     
         41 . The system of  claim 36 , wherein the first side of the at least one thermal conditioning device is configured to contact the skin surface. 
     
     
         42 . The system of  claim 36 , wherein the first side of the at least one thermal conditioning device is configured to not contact the skin surface. 
     
     
         43 . The system of  claim 42 , further comprising at least one spacer configured to maintain a clearance between the first side of the at least one thermal conditioning device and the skin surface of the subject during use. 
     
     
         44 . The system of  claim 43 , wherein the spacer comprises a smooth surface and/or a slidable or other movable feature or portion. 
     
     
         45 . The system of  claim 36 , further comprising at least one intermediate member or base, the at least one intermediate member or base being configured to support the at least one thermal conditioning device, wherein the at least one intermediate member or base is configured to at least partially contact the skin surface of the subject during use. 
     
     
         46 . The system of  claim 45 , wherein the at least one intermediate member or base comprises a layer of fabric or plastic. 
     
     
         47 . The system of  claim 45 , wherein the at least one intermediate member or base is at least partially flexible so as to generally conform to a shape of the subject's skin surface. 
     
     
         48 . The system of  claim 36 , wherein the system comprises a plurality of thermal conditioning devices. 
     
     
         49 . The system of  claim 48 , wherein at least two of the plurality of thermal conditioning devices are electrically and/or mechanically coupled to each other by at least one interconnecting member. 
     
     
         50 . The system of  claim 49 , further comprising at least one joint or movable feature along or near the at least one interconnecting member to provide additional flexibility to the system. 
     
     
         51 . The system of  claim 48 , wherein the thermal conditioning devices are arranged in a hexagonal pattern. 
     
     
         52 . The system of  claim 36 , further comprising at least one sensor. 
     
     
         53 . The system of  claim 52 , wherein the sensor comprises at least one of a temperature sensor, a humidity sensor, a condensation sensor and a pressure sensor. 
     
     
         54 . The system of  claim 36 , further comprising at least one thermal switch or fuse configured to automatically cease power delivery to the at least one thermal conditioning device when a temperature associated with the at least one thermal switch or fuse rises above a maximum threshold or drops below a minimum threshold. 
     
     
         55 . The system of  claim 36 , further comprising thermal insulation along at least a portion the surfaces of the heat sink.