Etching device for the electrolytic etching of copper

Abstract

An etching device for the electrolytic etching of copper on an etching material, includes a first mixing device, which is designed to receive an acid electrolyte containing copper ions, and an oxygen gas or ozone gas in order to form a first liquid-gas mixture which can be channeled from a first outlet of the first mixing device into a connecting line coupled thereto; a container, which contains a container liquid, a second mixing device, which is arranged in the container and is surrounded by the container liquid, wherein the second mixing device includes a suction opening in order to suction in the container liquid present in the region of the suction opening, wherein the second mixing device is connected to the connecting line and is designed to channel the first liquid-gas mixture and the suctioned container liquid into a constricted zone of the second mixing device so that the suctioned container liquid mixes with the first liquid-gas mixture and is thus able to form a second liquid-gas mixture, wherein the second mixing device has a second outlet out of which the second liquid-gas mixture is able to flow and mix with the container liquid present in the region of the second outlet, and a container outlet line, which is designed to feed the container liquid present there to the etching material provided in an etching module.

What is claimed: 
     
         1 - 6 . (canceled) 
     
     
         7 . An etching device for electrolytic etching of copper on an etching material, comprising:
 a first mixing device for receiving an acidic electrolyte containing copper ions and an oxygen gas or ozone gas, to thereby form a first liquid/gas mixture conductible out of a first outlet of the first mixing device into a connecting line coupled to the first mixing device;   a vessel containing a vessel liquid;   a second mixing device arranged within the vessel and surrounded by the vessel liquid, the second mixing device having a suction orifice for sucking in the vessel liquid present in a region of the suction orifice, the second mixing device being connected to the connecting line and configured to pass the first liquid/gas mixture and the sucked in vessel liquid into a constriction zone of the second mixing device, such that the vessel liquid mixes with the first liquid/gas mixture thereby forming a second liquid/gas mixture, the second mixing device having a second outlet for discharging the second liquid/gas mixture so as to be mixed with the vessel liquid present in a region of the second outlet, and   a vessel outlet line for supplying the vessel liquid to the etching material provided in an etching module.   
     
     
         8 . The etching device as claimed in  claim 7 , wherein the first mixing device is constructed as a Venturi nozzle or a liquid jet gas compressor. 
     
     
         9 . The etching device as claimed in  claim 7 , wherein the second mixing device is arranged in the lower half of the vessel and the vessel outlet line is arranged above the second mixing device. 
     
     
         10 . The etching device as claimed in  claim 7 , wherein there is a distance of at least one meter between the vessel outlet line and the second mixing device. 
     
     
         11 . The etching device as claimed in  claim 7 , wherein the vessel has a height of at least 1.5 meters with a volume of at least 400 liters of vessel liquid. 
     
     
         12 . The etching device as claimed in  claim 7 , wherein the first mixing device is capable of accommodating at least 100 liters per minute of acidic electrolyte and at least 50 liters per minute of oxygen gas or ozone gas.