Liquid applicator

Abstract

A liquid applicator includes: a reservoir disposed in a barrel body and storing an application liquid such as a fluid cosmetic or the like; an application part fixed to a front end part of the barrel body by means of a joint and a front barrel so as to be put into contact with a target site to apply the application liquid to the site; and, a propelling mechanism disposed in the rear part of the barrel body to propel the application liquid from the reservoir to the application part, and wherein a delivery opening is formed in a front end of the application part and, at least, a surface of the application part around a deliver opening is formed of a high thermal conductivity material.

What is claimed is: 
     
         1 . A liquid applicator comprising:
 a reservoir disposed in a barrel body and storing an application liquid such as a fluid cosmetic;   an application part fixed to a front end part of the barrel body by means of a joint and a front barrel so as to be put into contact with a target site to apply the application liquid to the site; and,   a propelling mechanism disposed in the rear part of the barrel body to propel the application liquid from the reservoir to the application part, and   wherein a delivery opening is formed in a front end of the application part and, at least, a surface of the application part around a deliver opening is formed of a high thermal conductivity material.   
     
     
         2 . The liquid applicator according to  claim 1 , wherein the application part is formed in a center of the front end part thereof, with a through-hole through which the application liquid is delivered. 
     
     
         3 . The liquid applicator according to  claim 1 , wherein the application part is spherical. 
     
     
         4 . The liquid applicator according to  claim 2 , wherein the application part includes a metallic part machined by press-forming. 
     
     
         5 . The liquid applicator according to  claim 1 , wherein, at least, the surface of the application part has a thermal conductivity of 1 W/m·K or greater.