Abrasive Device

Abstract

An abrasive device including at least one substrate, provided as a carrier element of a binder layer at least partially accommodating at least one abrasive grain, and having at least one fastening element, configured to detachably fasten the at least one substrate to an abrasive handling device.

What is claimed is: 
     
         1 . An abrasive device comprising:
 a binder layer configured to at least partially accommodate at least one abrasive grain;   at least one substrate including a carrier element of the binder layer; and   at least one adhesion fastening element configured to detachably fasten the at least one substrate to an abrasive handling device.   
     
     
         2 . The abrasive device of  claim 1 , wherein the at least one adhesion fastening element is configured as a contact adhesive element. 
     
     
         3 . The abrasive device of  claim 1 , wherein the at least one adhesion fastening element is configured as a pressure-sensitive contact adhesive element. 
     
     
         4 . The abrasive device of  claim 1 , wherein the binder layer is located on a side of the at least one substrate that is facing away from the at least one adhesion fastening element. 
     
     
         5 . The abrasive device of  claim 1 , wherein the at least one substrate is formed of a foam. 
     
     
         6 . The abrasive device of  claim 1 , wherein the at least one substrate is formed of an open-pore foam. 
     
     
         7 . The abrasive device of  claim 1 , further comprising:
 at least one suction cavity which is introduced at least into the at least one substrate.   
     
     
         8 . The abrasive device of  claim 7 , wherein the suction cavity extends through the at least one substrate and the at least one adhesion fastening element. 
     
     
         9 . The abrasive device of  claim 1 , wherein the at least one substrate has a maximum thickness of more than 1 mm. 
     
     
         10 . A method of producing an abrasive device, comprising:
 supporting a binder layer with a substrate;   applying abrasive grains to the binder layer; and   applying an adhesion fastening element to the substrate, the adhesion fastening element configured to detachably fasten the substrate to an abrasive handling device.