Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board

Abstract

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.

1 . A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
 extruding a substrate material according to the shape of the Z-directed component;   selectively applying a conductive material to the extruded substrate material; and   forming the Z-directed component from the extruded substrate material.   
     
     
         2 . The method of  claim 1 , wherein extruding the substrate material according to the shape of the Z-directed component includes extruding a channel through the substrate material. 
     
     
         3 . The method of  claim 2 , wherein the extruded channel is formed in an interior portion of the extruded substrate material. 
     
     
         4 . The method of  claim 2 , wherein the extruded channel is formed along a longitudinal edge of the extruded substrate material. 
     
     
         5 . The method of  claim 1 , further comprising extruding the substrate material in longitudinal segments and combining the longitudinal segments according to the shape of the Z-directed component. 
     
     
         6 . The method of  claim 5 , wherein the longitudinal segments are combined after they are extruded. 
     
     
         7 . The method of  claim 5 , wherein the longitudinal segments are combined in a continuous process downstream from their extrusion. 
     
     
         8 . The method of  claim 7 , further comprising supporting the extruded longitudinal segments with a moving member from a downstream end of the substrate material as it advances. 
     
     
         9 . The method of  claim 1 , further comprising:
 dividing the extruded substrate material into a plurality of layers of the Z-directed component, wherein selectively applying the conductive material to the extruded substrate material includes applying the conductive material to a surface of at least one of the layers; and   combining a stack of the layers to form the Z-directed component.   
     
     
         10 . The method of  claim 9 , wherein applying the conductive material to the surface of the at least one layer includes:
 applying a mask to a top surface of the at least one layer that restricts the application of conductive material to selected portions of the at least one layer; and   screening conductive material through the mask onto the at least one layer.   
     
     
         11 . The method of  claim 10 , wherein the mask includes a physical mask placed on the top surface of the at least one layer. 
     
     
         12 . The method of  claim 10 , wherein the mask includes a photoresist layer applied to and developed on the top surface of the at least one layer. 
     
     
         13 . The method of  claim 12 , wherein screening conductive material through the mask onto the at least one layer includes spin coating liquid conductive material on top of the photoresist layer. 
     
     
         14 . The method of  claim 9 , wherein applying the conductive material to the surface of the at least one layer includes spin coating a top surface of the at least one layer with liquid conductive material and then selectively etching conductive material from the top surface of the at least one layer. 
     
     
         15 . The method of  claim 9 , wherein applying the conductive material to the surface of the at least one layer includes selectively jetting the conductive material onto the at least one layer. 
     
     
         16 . The method of  claim 9 , wherein applying the conductive material to the surface of the at least one layer includes applying a seed layer of conductive material onto a predetermined portion of the at least one layer and then applying additional conductive material by an electrolysis technique. 
     
     
         17 . The method of  claim 9 , wherein applying the conductive material to the surface of the at least one layer includes:
 positioning the at least one layer in a constraining plate having a side wall surface that is spaced from a side wall channel in the at least one layer forming a gap therebetween; and   applying conductive material in the gap formed between the side wall surface of the constraining plate and the side wall channel in the at least one layer to plate the side wall channel in the at least one layer with the conductive material.   
     
     
         18 . The method of  claim 9 , wherein combining the stack of the layers to form the Z-directed component includes heating and compressing the stacked layers to form an aggregate part. 
     
     
         19 . The method of  claim 18 , wherein the layers are compressed with a plug that includes a recess formed in an end thereof having a tapered rim around a periphery of the recess that forms a corresponding taper in at least one of a top surface and a bottom surface of the Z-directed component when the stack of formed layers is combined. 
     
     
         20 . The method of  claim 1 , further comprising:
 inserting the Z-directed component into the mounting hole in the printed circuit board; and   applying an adhesive to a surface of the printed circuit board external to the mounting hole, the adhesive contacting a surface of the Z-directed component when the Z-directed component is inserted into the mounting hole to prevent rotational and translational movement of the Z-directed component relative to the printed circuit board after insertion.   
     
     
         21 . The method of  claim 1 , further comprising forming a strip of conductive material along a side surface of the formed Z-directed component that connects to one of a top surface and a bottom surface of the Z-directed component to form a conductive bridge between the respective top or bottom surface of the Z-directed component and a trace on the printed circuit board.