Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

We claim: 
     
         1 . A method for creating a probe structure for contacting electronic components wherein the probe structure comprises a contact tip for contacting a first electronic component, a compliant body that comprises a distal end that is in contact with the contact tip and a proximal end for mounting to a second electronic component and an intermediate portion that extends from the distal end to the proximal end, and a bonding material for attaching the proximal end to a second electronic component, the method comprising:
 a) forming at least a portion of the compliant body from one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, wherein the compliant body comprises at least one of the at least one structural material;   b) forming a body of a bonding material from one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one bonding material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer; and   c) forming the contact tip from at least a portion of one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, and wherein during electrodeposition the contact tip is formed from at least one of the at least one structural material,
 wherein each successive layer is formed and simultaneously adhered to a previously formed layer. 
   
     
     
         2 . The method of  claim 1  wherein the intermediate portion provides a side profile of the probe and is formed in an orientation that places the side profile laying within a plane of at least one layer. 
     
     
         3 . The method of  claim 1  wherein the at least one structural material forming the compliant body portion of the probe comprises at least one material that is different from the at least one structural material forming the contact tip. 
     
     
         4 . The method of  claim 1  wherein a material forming a contact portion of the contact tip is different from any material forming the intermediate portion of the compliant body. 
     
     
         5 . The method of  claim 1  wherein the probe comprises a cantilever probe. 
     
     
         6 . The method of  claim 5  wherein the proximal end comprises an extended base portion, that extends at least partway under a cantilever element of the cantilever probe, wherein the extended base portion provides for contacting the second electronic component and wherein the bonding material and extended base portion are formed in at least partial contact. 
     
     
         7 . The method of  claim 5  wherein a cantilever element of the cantilever probe comprises a plurality of beam elements wherein at least part of each of the plurality of beam elements are formed within a single multi-material layer. 
     
     
         8 . The method of  claim 5  wherein the cantilever probe comprises a configuration including a primary beam and at least one additional beam that joins the primary beam and connects to an elongated base via a support element that is different from a support element that connects the primary beam to the elongated base. 
     
     
         9 . The method of  claim 1  wherein the method of creating a probe structure simultaneously creates a plurality of probe structures in batch process on a build substrate over which a release layer is formed and onto which the multiple materials are deposited. 
     
     
         10 . The method of  claim 9  wherein a plurality of probes are attached to the second electronic component, after release from the build substrate, in a desired configuration and wherein the contact tips are made to at least temporarily contact the first electronic component to provide an electrical connection between the first and second electronic components. 
     
     
         11 . The method of  claim 1  wherein the one or more multi-material layers from which the compliant body is formed comprise a plurality of layers and wherein the one or multiple material layers from which the contact tip is formed is or are the same as the multi-materials layers from which the compliant body is formed. 
     
     
         12 . The method of  claim 11  wherein at least a portion of the one or more layers from which the body of bonding material is or are formed is or are different from the one or more layers on which the compliant body is, or are, formed. 
     
     
         13 . The method of  claim 11  wherein at least a portion of the one or more layers from which the body of bonding material is, or are, formed is, or are, different from the one or more layers on which the contact tip is, or are, formed. 
     
     
         14 . The method of  claim 1  wherein the bonding material comprises solder. 
     
     
         15 . A method for creating a probe structure for contacting electronic components wherein the probe structure comprises a contact tip for contacting a first electronic component, a compliant body that comprises a distal end that is in contact with the contact tip and a proximal end for mounting to a second electronic component and an intermediate portion that extends from the distal end to the proximal end, and a bonding material for attaching the proximal end to a second electronic component, the method comprising:
 a) forming at least part of the compliant body;   b) forming at least one body of the bonding material; and   c) forming the contact tip;
 wherein the formation of each of the compliant body, the body of bonding material, and the contact tip comprise forming one or more multiple material layers of deposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, wherein the compliant body, the body of bonding material, and the contact tip, are each formed from at least one structural material deposited during the formation of their respective layer or layers, and 
 wherein layers are successively formed and adhered to previously formed layers. 
   
     
     
         16 . The method of  claim 15  wherein the intermediate portion provides a side profile of the probe and is formed in an orientation that places the side profile laying within a plane of at least one layer. 
     
     
         17 . The method of  claim 15  wherein the at least one structural material forming the compliant body portion of the probe comprises at least one material that is different from the at least one structural material forming the contact tip. 
     
     
         18 . The method of  claim 15  wherein a material forming a contact portion of the contact tip is different from any material forming the intermediate portion of the compliant body. 
     
     
         19 . The method of  claim 15  wherein the probe comprises a cantilever probe. 
     
     
         20 . The method of  claim 19  wherein a cantilever element of the cantilever probe comprises a plurality of beam elements wherein at least part of each of the plurality of beam elements are formed within a single multi-material layer.