Adjustable current shield for electroplating processes

Abstract

One illustrative plating apparatus disclosed herein includes a substrate holder that is adapted to receive a substrate, an anode and an adjustable current shield positioned between the substrate holder and the anode. In this illustrative embodiment, the adjustable current shield includes a stationary member, a moveable member that is adapted to be moved relative to the stationary member and a plurality of current shield members that are operatively coupled to either the stationary member or the moveable member, wherein each of the current shield members is rotatably pinned to either the stationary member or the moveable member and wherein each of the current shield members is adapted to rotate when there is relative movement between the moveable member and the stationary member.

What is claimed: 
     
         1 . A plating apparatus, comprising:
 a substrate holder that is adapted to receive a substrate;   an anode; and   an adjustable current shield positioned between said substrate holder and said anode,
 wherein said adjustable current shield comprises: 
 a stationary member; 
 a moveable member that is adapted to be moved relative to said stationary member; and 
 a plurality of current shield members operatively coupled to said stationary member and said moveable member, wherein each of said plurality of current shield members is rotatably pinned to one of said stationary member or said moveable member and wherein each of said current shield members is adapted to rotate when there is relative movement between said moveable member and said stationary member. 
   
     
     
         2 . The apparatus of  claim 1 , wherein said substrate holder is located vertically above said anode and said adjustable current shield is located vertically above said anode. 
     
     
         3 . The apparatus of  claim 1 , wherein each of said substrate holder, said anode and said adjustable current shield are oriented substantially vertically, and wherein said adjustable current shield is located laterally between said substrate holder and said anode. 
     
     
         4 . The apparatus of  claim 1 , wherein said stationary and moveable members each have a ring configuration. 
     
     
         5 . The apparatus of  claim 1 , further comprising means for moving said moveable member relative to said stationary member. 
     
     
         6 . The apparatus of  claim 1 , further comprising a plurality of gear teeth that are operatively coupled to said moveable member. 
     
     
         7 . The apparatus of  claim 1 , further comprising a lever that is operatively coupled to said moveable member. 
     
     
         8 . The apparatus of  claim 1 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps a portion of an adjacent current shielding member. 
     
     
         9 . The apparatus of  claim 1 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps and contacts a portion of an adjacent current shielding member. 
     
     
         10 . A plating apparatus, comprising:
 a substrate holder that is adapted to receive a substrate;   an anode; and   an adjustable current shield positioned between said substrate holder and said anode,
 wherein said adjustable current shield comprises: 
 a stationary member; 
 a moveable member that is adapted to be moved relative to said stationary member; and 
 a plurality of current shield members operatively coupled to said stationary member and said moveable member, wherein each of said plurality of current shield members is rotatably pinned to one of said stationary member or said moveable member and wherein a portion of each of said current shield members is adapted to be moved inward or outward when there is relative movement between said moveable member and said stationary member depending upon the direction of such relative movement. 
   
     
     
         11 . The apparatus of  claim 10 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps a portion of an adjacent current shielding member. 
     
     
         12 . The apparatus of  claim 11 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps and contacts a portion of an adjacent current shielding member. 
     
     
         13 . The apparatus of  claim 10 , wherein said substrate holder is located vertically above said anode and said adjustable current shield is located vertically above said anode. 
     
     
         14 . The apparatus of  claim 10 , wherein each of said substrate holder, said anode and said adjustable current shield are oriented substantially vertically, and wherein said adjustable current shield is located laterally between said substrate holder and said anode. 
     
     
         15 . A plating apparatus, comprising:
 a substrate holder that is adapted to receive a substrate;   an anode; and   an adjustable current shield positioned between said substrate holder and said anode,
 wherein said adjustable current shield comprises: 
 a stationary ring; 
 a moveable ring that is adapted to be moved relative to said stationary ring; and 
 a plurality of current shield members operatively coupled to said stationary ring and said moveable ring, wherein each of said plurality of current shield members is rotatably pinned to one of said stationary ring or said moveable ring and wherein each of said current shield members is adapted to rotate when there is relative movement between said moveable ring and said stationary ring, thereby moving a portion of each of said current shield members radially inward or outward depending upon the direction of such relative movement. 
   
     
     
         16 . The apparatus of  claim 15 , wherein said substrate holder is positioned above said anode and said adjustable current shield is positioned above said anode. 
     
     
         17 . The apparatus of  claim 15 , further comprising means for moving said moveable member relative to said stationary member. 
     
     
         18 . The apparatus of  claim 15 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps a portion of an adjacent current shielding member. 
     
     
         19 . The apparatus of  claim 15 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps and contacts a portion of an adjacent current shielding member. 
     
     
         20 . The apparatus of  claim 15 , wherein said substrate holder is located vertically above said anode and said adjustable current shield is located vertically above said anode. 
     
     
         21 . The apparatus of  claim 15 , wherein each of said substrate holder, said anode and said adjustable current shield are oriented substantially vertically, and wherein said adjustable current shield is located laterally between said substrate holder and said anode. 
     
     
         22 . A plating apparatus, comprising:
 a substrate holder that is adapted to receive a substrate;   an anode; and   an adjustable current shield positioned between said substrate holder and said anode,
 wherein said adjustable current shield comprises: 
 a stationary ring; 
 a moveable ring that is adapted to be moved relative to said stationary ring; and 
 a plurality of current shield members operatively coupled to said stationary ring and said moveable ring, wherein each of said plurality of current shield members is rotatably pinned to said stationary ring and wherein each of said current shield members is adapted to rotate when said moveable ring is moved relative to said stationary ring, thereby moving a portion of each of said current shield members radially inward or outward depending upon the direction of movement of said moveable ring relative to said stationary ring. 
   
     
     
         23 . The apparatus of  claim 22 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps a portion of an adjacent current shielding member. 
     
     
         24 . The apparatus of  claim 23 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of current shielding members overlaps and contacts a portion of an adjacent current shielding member. 
     
     
         25 . The apparatus of  claim 22 , wherein said substrate holder is located vertically above said anode and said adjustable current shield is located vertically above said anode. 
     
     
         26 . The apparatus of  claim 22 , wherein each of said substrate holder, said anode and said adjustable current shield are oriented substantially vertically, and wherein said adjustable current shield is located laterally between said substrate holder and said anode. 
     
     
         27 . A plating apparatus, comprising:
 a substrate holder that is adapted to receive a substrate;   an anode; and   an adjustable current shield positioned between said substrate holder and said anode, wherein said adjustable current shield comprises a plurality of segmented shielding members that may be moved so as to effectively change a size of an opening of said adjustable current shield.   
     
     
         28 . The apparatus of  claim 27 , wherein, when said adjustable current shield is in a fully closed position, a portion of each of said plurality of segmented shielding members overlaps and contacts a portion of an adjacent segmented shielding member. 
     
     
         29 . The apparatus of  claim 27 , wherein a portion of each of said plurality of segmented shielding members is adapted to move radially inward or outward when moved. 
     
     
         30 . The apparatus of  claim 27 , wherein said size is an effective diameter of said opening.