US2014231151A1PendingUtilityA1
Optimum powder placement in polycrystalline diamond cutters
Est. expiryJan 28, 2033(~6.5 yrs left)· nominal 20-yr term from priority
Inventors:Terry R. MatthiasMark Jonathan FrancisSimon BrownKevin EmeryPaul E. Ellis, Jr.Michael Scott Nixon
C22C 26/00B24D 18/0009B22F 3/10B22F 2005/001B22F 7/06E21B 10/5735
50
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Claims
Abstract
A precise and reproducible method of making a cutter element for a cutting tool includes positioning at least a first material layer of powder; a substrate and sintering. Whereby the positioning is performed by a fill to weight system, and comprises depositing the first material at a rate of about 1 mg per second to about 300 mg per second by the automated system.
Claims
exact text as granted — not AI-modified1 . A method of making a cutter element for a cutting tool comprising:
positioning at least a first material layer of powder in a container; positioning a second material layer adjacent to said at least a first material layer, to form a non-planer interface between said first and second material layer, wherein said positioning is by a fill to weight system, and said positioning comprises depositing said first material layer and said second material layer at a rate of about 1 mg per second to about 300 mg per second; loading a substrate in the container; and sintering to form a cutter element.
2 . The method of making a cutter element of claim 1 , wherein said first material layer comprises: diamond powder; and said second material layer comprises metal carbide.
3 . The method of making a cutter element of claim 2 , wherein said first material layer comprises metal carbide.
4 . The method of making a cutter element of claim 3 , further comprising:
removing the metal carbide to form a non-planer cutter surface.
5 . The method of making a cutter element of claim 1 , wherein said positioning optimizes packing density between said material and said substrate, forming a uniform interface between said material and said substrate.
6 . The method of claim 1 , further comprising:
positioning a second material in the container adjacent to said first material; and after sintering, eroding one of said first and second materials.
7 . The method of claim 1 , wherein said positioning of said first material comprises positioning about 1 mg to about 1700 mg.
8 . A cutter element comprising: a substrate; and at least a first material layer, wherein said element is made by the method of claim 1 .
9 . The cutter element of claim 8 , wherein said first material is coupled to the substrate through a non-planer interface.
10 . The cutter element of claim 8 , further comprising a second material layer, wherein said second layer is coupled to the first layer through a non-planer interface.
11 . The cutter element of claim 10 , wherein the second material layer comprises metal carbide.
12 . The cutter element of claim 8 , further comprising an erodible material layer, wherein said erodible material layer is coupled to the first material layer through a non-planer interface.
13 . The cutter element of claim 12 , wherein said erodible material comprises the cutting face of the cutter element.
14 . The cutter element of claim 12 , wherein said erodible material comprises metal carbide.
15 . The cutter element of claim 8 , further comprising an erodible material layer forming at least a portion of the cutting face of the cutter element.
16 . The cutter element of claim 8 , wherein said first material possesses mono-modal properties, multi-modal properties or combinations thereof, wherein said properties comprise physical composition, chemical composition or combinations thereof.
17 . The cutter element of claim 16 , wherein said physical composition comprises, particle size, particle shape, density, thermal conductivity, porosity or combinations thereof.
18 . The cutter element of claim 8 , further comprising a second material, wherein said second material layer comprises polycrystalline diamond and said first layer is an erodible material, wherein said erodible material comprises a region of the cutting face of said element.
19 . The cutter element of claim 13 , wherein said region is concaved.
20 . The cutter element of claim 13 , wherein said region comprises perimeter of the cutting face.Join the waitlist — get patent alerts
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