Building support with concealed electronic component for a structure

Abstract

Building support with a concealed electronic component for a structure, including: a rigid support member; a mounting attachment affixed to the rigid support member, the mounting attachment adapted to support an electronic component; and a transceiver coupled to the electronic component, the transceiver adapted to support an external communication link. Other embodiments provide a backing material to support an electronic component concealed within a building structural element, wherein the building structural element comprises one or more rigid building support members, the backing material including: a substrate; a structure attachment along at least one surface of the substrate, the attachment adapted to attach the substrate to a rigid building support member; and one or more electronic component attachments disposed on a major surface of the rigid substrate.

What is claimed is: 
     
         1 . A building support with a concealed electronic component for a structure, comprising:
 a rigid support member;   a mounting attachment affixed to the rigid support member, the mounting attachment adapted to support the concealed electronic component; and   a transceiver coupled to the concealed electronic component, the transceiver adapted to support an external communication link.   
     
     
         2 . The building support of  claim 1 , wherein the building support comprises a wall stud. 
     
     
         3 . The building support of  claim 1 , wherein the building support comprises a floor joist. 
     
     
         4 . The building support of  claim 1 , wherein the building support comprises a heating and cooling duct. 
     
     
         5 . The building support of  claim 1 , wherein the building support comprises a concrete slab, the concrete slab comprising a void adapted to enclose the concealed electronic component. 
     
     
         6 . The building support of  claim 1 , wherein the building support is positioned in an area above a false ceiling. 
     
     
         7 . The building support of  claim 1 , wherein the building support is positioned in an area below a raised floorboard. 
     
     
         8 . The building support of  claim 1 , wherein the building support comprises an item selected from a group consisting of a hollow core door, a rooftop, an outdoor structure, an element of a garage, an element of a shed. 
     
     
         9 . A backing material to support an electronic component concealed within a building structural element, wherein the building structural element comprises one or more rigid building support members, the backing material comprising:
 a substrate;   a structure attachment along at least one surface of the substrate, the attachment adapted to attach the substrate to a rigid building support member; and   one or more electronic component attachments disposed on a major surface of the rigid substrate.   
     
     
         10 . The backing material of  claim 9 , wherein the substrate comprises a flexible substrate, wherein the substrate when draped between adjacent rigid building support members, is adapted to substantially maintain a predetermined relative physical configuration among a plurality of electronic components coupled to the one or more electronic component attachments. 
     
     
         11 . The backing material of  claim 9 , wherein the substrate comprises a substantially rigid substrate. 
     
     
         12 . The backing material of  claim 9 , wherein the rigid building support member comprises a wall stud. 
     
     
         13 . The backing material of  claim 9 , wherein the substrate is adapted to be supported by one rigid building support member. 
     
     
         14 . The backing material of  claim 9 , wherein the substrate may be coupled to a second substantially rigid substrate. 
     
     
         15 . The backing material of  claim 9 , wherein the electronic component comprises a data storage device. 
     
     
         16 . The backing material of  claim 10 , wherein the plurality of electronic components comprise a data farm. 
     
     
         17 . The backing material of  claim 16 , wherein the plurality of electronic components further comprise a transceiver adapted to support an external communication link.