Surface modifier for polyimide resin and surface-modifying method for polyimide resin
Abstract
The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.
Claims
exact text as granted — not AI-modified1 . A polyimide resin surface modifier which contains an alkali component and an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, wherein the water content is 0-10% by weight.
2 . The polyimide resin surface modifier according to claim 1 , which further contains a water-soluble polymer compound.
3 . The polyimide resin surface modifier according to claim 1 , wherein said alkali component is selected from the group consisting of an alkali metal hydroxide and a quaternary ammonium hydroxide.
4 . The polyimide resin surface modifier according to claim 1 , wherein said organic solvent is an alcoholic compound.
5 . The polyimide resin surface modifier according to claim 4 , wherein said alcoholic compound is selected from the group consisting of hydrocarbon-type alcohols, alkylene glycols and glycol ethers.
6 . The polyimide resin surface modifier according to claim 2 , wherein said water-soluble polymer compound is selected from the group consisting of polyvinyl pyrrolidone, polyvinyl alcohol and carboxy methylcellulose.
7 . A surface-modifying method for a polyimide resin which comprises
a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using a polyimide resin surface modifier containing an alkali component and an organic solvent having hydroxy groups and a boiling point of 120° C. or higher wherein the water content is 0-10% by weight, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.
8 . The surface-modifying method for a polyimide resin according to claim 7 , wherein said polyimide resin surface modifier further contains a water-soluble polymer compound.
9 . The surface-modifying method for a polyimide resin according to claim 7 , wherein said printing is carried out by a screen printing method.
10 . The surface-modifying method for a polyimide resin according to claim 7 , wherein said printing is carried out by an inkjet printing method.
11 . The polyimide resin surface modifier according to claim 2 , wherein said alkali component is selected from the group consisting of an alkali metal hydroxide and a quaternary ammonium hydroxide.
12 . The polyimide resin surface modifier according to claim 2 , wherein said organic solvent is an alcoholic compound.
13 . The polyimide resin surface modifier according to claim 12 , wherein said alcoholic compound is selected from the group consisting of hydrocarbon-type alcohols, alkylene glycols and glycol ethers.
14 . The surface-modifying method for a polyimide resin according to claim 8 , wherein said printing is carried out by a screen printing method.
15 . The surface-modifying method for a polyimide resin according to claim 8 , wherein said printing is carried out by an inkjet printing method.Join the waitlist — get patent alerts
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