Bendable circuit board for led mounting and interconnection

Abstract

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

What is claimed is: 
     
         1 . A bendable laminated structure for mounting light emitting diodes (“LED”) comprising,
 a. an aluminum metal layer between about 0.2 millimeters and 2 millimeters in thickness; 
 b. a polyimide layer directly contacting one side of the aluminum metal layer; and 
 c. a copper foil layer directly another side of the polyimide layer; 
 
       wherein the laminated structure has a thickness between about 0.2 millimeters to about 3 millimeters and increases in electrical resistance by less than 10% after being bent at an angle of 90° or greater. 
     
     
         2 . The structure of  claim 1  wherein the copper layer is about 35 um thick, the polyimide layer is at about 0.12 millimeters thick and the aluminum layer is about 0.2 millimeters to 0.247 millimeters thick. 
     
     
         3 . The structure of  claim 1  wherein the aluminum metal layer is about 0.4 mm to about 2 mm in thickness. 
     
     
         4 . The structure of  claim 1 , where the copper layer is a circuitized layer. 
     
     
         5 . The structure of  claim 1  wherein the aluminum is anodized. 
     
     
         6 . The structure of  claim 1  wherein the aluminum is treated with a chemical conversion coating. 
     
     
         7 . The structure of  claim 1  wherein the aluminum is aluminum Alloy 5005. 
     
     
         8 . A method of manufacturing a laminated structure for mounting light emitting diodes (“LED”) to a 90° or greater configured angle, comprising:
 a. providing a bendable a laminate circuit structure, the bendable laminate circuit structure having at least the following laminated layers:
 i. an aluminum metal layer of about 0.2 mm to about 2 mm in thickness; 
 ii. a polyimide composite layer having a first surface directly contacting the first surface of the aluminum metal layer; and 
 iii. a copper foil layer directly contacting a second surface of the polyimide composite layer; and 
 
 b. bending the laminated layers 90° or more, such that after bending the laminated layers the bendable circuit structure for mounting LED mounting has an increase in electrical resistance of less than 10%. 
 
     
     
         9 . The method of  claim 8  wherein the providing step include providing a laminate wherein the copper layer is about 35 um thick, the polyimide layer is about 12 um thick and the aluminum layer is about 200 um to 247 um thick. 
     
     
         10 . The laminate of  claim 8  wherein the providing step includes providing an aluminum metal layer of about 0.4 mm to about 2 mm in thickness. 
     
     
         11 . The method of  claim 8 , wherein the bendable laminate structure has a thickness to about 3 millimeters. 
     
     
         12 . The method of  claim 8 , where the copper layer of the laminated layers is a circuitized layer. 
     
     
         13 . A bent, laminated circuit, bent at 90° or greater to form a reconfigured structure, comprising,
 a. an aluminum metal layer between about 0.3 mm and 2 mm um in thickness; 
 b. a polyimide layer directly contacting one side of the aluminum metal layer; and 
 c. a copper foil layer directly another side of the polyimide layer; 
 
       wherein the structure has a thickness up to about 3 millimeters, and the reconfigured structure has an increased electrical resistance of less than 10% as a result of being bent an angle of 90° or greater. 
     
     
         14 . The structure of  claim 13 , where the copper layer is a circuitized layer. 
     
     
         15 . The structure of  claim 13  wherein the aluminum is anodized. 
     
     
         16 . The structure of  claim 13  wherein the aluminum is aluminum Alloy 5005.