Power module package and method for manufacturing the same

Abstract

Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

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         9 . A method for manufacturing a power module package, the method comprising:
 preparing a substrate having one surface and the other surface and including a circuit pattern formed on one surface thereof and including a chip mounting pad and an external connection pad;   forming an opening penetrating the substrate in a thickness direction at a portion in contact with the external connection pad in the substrate;   forming a fastening unit in contact with the external connection pad in the opening;   mounting a semiconductor chip on the chip mounting pad; and   insertedly fastening one end of the external connection terminal into the fastening unit.   
     
     
         10 . The method as set forth in  claim 9 , wherein in the forming of the opening penetrating the substrate in the thickness direction, the opening is formed by using a laser drill or a mechanical drill. 
     
     
         11 . The method as set forth in  claim 9 , wherein the forming of the fastening unit includes:
 inserting a cylindrical member having a recess formed in a length direction therein into the opening of the substrate; and   pressurizing a portion, of the cylindrical member inserted into the opening, protruded from the surface of the substrate.   
     
     
         12 . The method as set forth in  claim 11 , wherein the substrate includes:
 a metal plate;   an insulating layer formed on one surface of the metal plate; and   a circuit pattern formed on the insulating layer and including a chip mounting pad and an external connection pad,   wherein the cylindrical member inserted into the opening includes a portion made of a conductive material and a portion made of a non-conductive material,   wherein the portion made of a conductive material is in contact with the external connection pad and the portion made of the non-conductive material is in contact with the metal plate.   
     
     
         13 . The method as set forth in  claim 11 , wherein the substrate includes:
 a metal plate;   an insulating layer formed on one surface of the metal plate; and   a circuit pattern formed on the insulating layer and including a chip mounting pad and an external connection pad,   wherein the cylindrical member inserted into the opening is made of a non-conductive material; and   the method further comprising:   forming a lead frame for electrically connecting the external connection terminal to the external connection pad, before the insertedly fastening of the external connection terminal into the fastening unit.   
     
     
         14 . The method as set forth in  claim 9 , wherein the forming of the fastening unit includes:
 mounting a female screw in the opening; and   fastening a male screw having a recess for insertedly fastening the external connection terminal thereon to the female screw in a length direction therein.   
     
     
         15 . The method as set forth in  claim 14 , wherein the female screw is made of a non-conductive material, and the male screw is made of a conductive material. 
     
     
         16 . The method as set forth in  claim 9 , further comprising:
 forming a case on the substrate such that it covers one surface of the substrate and the semiconductor chip and exposes the other end of the external connection terminal to the outside, after the insertedly fastening of the external connection terminal into the fastening unit.   
     
     
         17 . The method as set forth in  claim 16 , further comprising:
 injecting a molding material into the case to form a molding member covering one surface of the substrate and the semiconductor chip, after the forming of the case.   
     
     
         18 . The method as set forth in  claim 9 , further comprising:
 performing a wire bonding process in order to electrically connect the semiconductor chip to the circuit pattern, after the mounting of the semiconductor chip.