Cooling assembly and dehumidification method

Abstract

A cooling assembly includes a device chamber containing a device chamber cooling medium, a heat exchanger including at least one cooling surface in contact with the device chamber cooling medium, a control unit configured to control the heat exchanger, a humidity sensor configured to detect a humidity level in the device chamber, and a receptacle. The control unit is configured to perform a dehumidification operation as a response to the humidity level exceeding a predetermined threshold value in the device chamber. The dehumidification operation includes lowering a temperature of the at least one cooling surface in order to condensate water from the device chamber cooling medium on the at least one cooling surface. The receptacle is configured to receive water dripping from the at least one cooling surface.

What is claimed is: 
     
         1 . A cooling assembly comprising:
 a device chamber containing a device chamber cooling medium;   heat exchanger means comprising at least one cooling surface in contact with the device chamber cooling medium;   control means for controlling the heat exchanger means;   humidity sensor means for detecting a humidity level in the device chamber; and   a receptacle,   wherein the control means is configured to perform a dehumidification operation as a response to the detected humidity level exceeding a predetermined threshold value in the device chamber,   wherein the dehumidification operation comprises lowering a temperature of the at least one cooling surface to condensate water from the device chamber cooling medium on the at least one cooling surface, and   wherein the receptacle is configured to receive water dripping from the at least one cooling surface.   
     
     
         2 . A cooling assembly according to  claim 1 , wherein the cooling assembly comprises a discharge tube for discharging water from the receptacle out of the device chamber. 
     
     
         3 . A cooling assembly according to  claim 2 , wherein the discharge tube has a capillary structure for discharging water from the receptacle out of the device chamber. 
     
     
         4 . A cooling assembly according to  claim 1 , wherein the heat exchanger means comprise a device chamber cooling unit for transferring heat out of the device chamber, the device chamber cooling unit comprising a first portion located in the device chamber and a second portion located outside the device chamber, the first portion having a cooling surface in contact with the device chamber cooling medium. 
     
     
         5 . A cooling assembly according to  claim 4 , wherein the first portion of the device chamber cooling unit is in an operating situation located lower than the second portion of the device chamber cooling unit. 
     
     
         6 . A cooling assembly according to  claim 1 , wherein the heat exchanger means comprise an internal heat exchanger unit for transferring heat from a cooling surface of the internal heat exchanger unit to elsewhere inside the device chamber. 
     
     
         7 . A cooling assembly according to  claim 1 , wherein the cooling assembly further comprises heating means for heating the device chamber, the heating means being spaced apart from the at least one cooling surface, and
 wherein the dehumidification operation comprises heating the device chamber cooling medium with the heating means to evaporate moisture in the device chamber.   
     
     
         8 . A cooling assembly according to  claim 7 , wherein the dehumidification operation comprises alternately heating the device chamber with the heating means and lowering a temperature of the at least one cooling surface. 
     
     
         9 . A cooling assembly according to  claim 7 , wherein the cooling assembly further comprises device chamber fan means for transferring the device chamber cooling medium from the heating means to the at least one cooling surface. 
     
     
         10 . A cooling assembly according to  claim 1 , wherein the at least one cooling surface comprises a hydrophobic coating for facilitating dripping of water from the at least one cooling surface to the receptacle. 
     
     
         11 . A cooling assembly according to  claim 1 , wherein the at least one cooling surface comprises anti-bacterial material. 
     
     
         12 . A cooling assembly according to  claim 11 , wherein an inner surface of the receptacle comprises the anti-bacterial material. 
     
     
         13 . A cooling assembly according to  claim 1 , wherein an inner surface of the receptacle comprises anti-bacterial material. 
     
     
         14 . A dehumidification method comprising:
 detecting a humidity level in a device chamber containing a device chamber cooling medium;   as a response to the detected humidity level exceeding a predetermined threshold value in the device chamber, lowering a temperature of at least one cooling surface in contact with the device chamber cooling medium to condensate water from the device chamber cooling medium on the at least one cooling surface; and   collecting water dripping from the at least one cooling surface in a receptacle.   
     
     
         15 . A dehumidification method according to  claim 14 , comprising:
 heating the device chamber cooling medium to evaporate moisture in the device chamber, the heating being carried out at a distance from the at least one cooling surface; and   transferring the heated device chamber cooling medium containing evaporated moisture to the at least one cooling surface.   
     
     
         16 . A dehumidification method according to  claim 15 , wherein the heating of the device chamber cooling medium and the lowering of the temperature of the at least one cooling surface are repeated alternately.