Antenna pattern frame, case of electronic device and mould for manufacturing the same

Abstract

There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

1 - 11 . (canceled) 
     
     
         12 . A mould for manufacturing an antenna pattern frame, comprising:
 upper and lower moulds receiving a radiator that includes an antenna pattern part transmitting and receiving signals, a connection terminal part connected to a circuit substrate of an electronic device, and a connection part connecting the antenna pattern part to the connection terminal part; and   when the upper and lower moulds are combined with each other, a resin material introducing part formed in any one of the upper, lower, or upper and lower moulds to introduce a resin material into an inner space so that the inner space of the upper and lower moulds becomes the radiator frame to embed the antenna pattern part in the case of the electronic device,   wherein the lower mould includes a guide groove so that the radiator frame includes a guide boss that is inserted into the manufacturing mould for injection-molding the case of the electronic device and the radiator is the radiator frame by the inner space.   
     
     
         13 . The mould for manufacturing an antenna pattern frame of  claim 12 , wherein the lower mould includes a protruding part corresponding to the slot part in the guide groove to form a slot part in the guide boss. 
     
     
         14 . The mould for manufacturing an antenna pattern frame of  claim 12 , wherein any one of the upper, lower, or upper and lower moulds includes an interrupting boss that prevents the resin material from being introduced in order to form an introducing hole for introducing the resin material on the antenna pattern frame when the case of the electronic device is injection-molded. 
     
     
         15 . The mould for manufacturing an antenna pattern frame of  claim 12 , wherein the inner space of the upper and lower moulds receives the connection terminal part and includes a radiator supporting part forming groove in order to form the radiator supporting part supporting the connection terminal part. 
     
     
         16 . The mould for manufacturing an antenna pattern frame of  claim 12 , wherein any one of the upper, lower or upper and lower moulds is provided with a compression pin that compresses the connection terminal part disposed in the radiator supporting part forming groove. 
     
     
         17 . A mould for manufacturing a case of an electronic device, comprising:
 upper and lower moulds that receive a radiator including an antenna pattern part transmitting or receiving signals, a radiator including a connection terminal part contacting a circuit substrate of an electronic device, a radiator frame supporting the radiator, and an antenna pattern frame including a guide boss formed to be protruded from one surface of the radiator frame; and   when the upper and lower moulds are combined with each other, a resin material introducing part formed in any one of the upper, lower, or upper and lower moulds to form a case of an electronic device by combining the antenna pattern frame with the resin material due to the introduction of the resin material in the inner space of the upper and lower moulds;   wherein the lower mould includes a guide groove formed to insert the guide boss and the antenna pattern frame is the case of the electronic device by the inner space.   
     
     
         18 . The mould for manufacturing the case of the electronic device of  claim 17 , wherein the guide groove includes the guide boss receiving part to fix and support the guide boss. 
     
     
         19 . The mould for manufacturing the case of the electronic device of  claim 18 , wherein the guide boss receiving part is configured of a variable part having a diameter larger than that of the guide boss and a fixing part having a diameter smaller than that of the variable part. 
     
     
         20 . The mould for manufacturing the case of the electronic device of  claim 19 , wherein the variable part receives the guide boss by being protruded to the upper portion of the lower mould before the guide boss is inserted, and is inserted into the guide groove of the lower mould after the guide boss is received.