Heat-dissipation system for preventing inrush current

Abstract

A heat-dissipation system includes a shell, a fan, a latch, and a micro-switch. The fan includes a first connector and a second connector. The first connector includes a number of signal pins, a zero line pin, and a live line pin. The signal pins are used to transmit signals between a motherboard and the fan. The zero line pin and the live line pin are connected to a power supply. The zero line pin of the first connector is connected to a zero line pin of the second connector. When the latch is engaged with the shell, the micro-switch is turned on and the power supply supplies power to the second connector through the micro-switch and the zero and live line pins of the first connector. When the latch is not engaged with the shell, the micro-switch is turned off and the power supply is disconnected from the second connector.

What is claimed is: 
     
         1 . A heat-dissipation system, comprising:
 a shell defining a receiving space;   a fan detachably received in the receiving space;   a latch detachably engaged with the shell to block the fan and prevent the fan disengaging from the receiving space;   a first connector comprising a zero line pin and a live line pin, wherein the zero line pin and the live line pin are connected to a power supply;   a second connector comprising a live line pin and a zero line pin, wherein the zero line pin of the second connector is connected to the zero line pin of the first connector;   a power module connected to the zero line pin and the live line pin of the second connector; and   a micro-switch set on the latch, wherein the micro-switch is connected between the live line pin of the first connector and the live line pin of the second connector; when the latch is not engaged with the shell, the micro-switch is turned off; when the latch is engaged with the shell, the micro-switch is turned on.   
     
     
         2 . The heat-dissipation system of  claim 1 , wherein the shell comprises a backplane, two side plates extending from two opposite sides of the backplane, and two mounting plates extending from the backplane and connected between the side plates; the backplane, two mounting plates, and side plates cooperatively bound the receiving space, and the side plates define two vents aligning with each other and communicating with the receiving space. 
     
     
         3 . The heat-dissipation system of  claim 2 , wherein the first connector is exposed through the backplane. 
     
     
         4 . The heat-dissipation system of  claim 1 , wherein the first connector further comprises a plurality of signal pins used to transmit signals between a motherboard and the fan.