US2014199523A1PendingUtilityA1

Method of forming a microstructure

Assignee: 3M INNOVATIVE PROPERTIES COPriority: Jun 30, 2008Filed: Mar 18, 2014Published: Jul 17, 2014
Est. expiryJun 30, 2028(~1.9 yrs left)· nominal 20-yr term from priority
C09D 11/52H05K 2201/09036C23C 18/06H05K 1/0284H05K 3/1258C23C 18/1608C23C 18/30G02F 2202/22B32B 3/30G02F 1/155H05K 2201/09827Y10T428/2462C23C 18/08H05K 3/182H05K 9/0096H05K 3/107
63
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An article comprising:
 a transparent substrate comprising a major surface with a major surface contour and having a structured surface region comprising one or more recessed features having recessed surfaces, the structured surface region substantially free of plateaus;   an electrically conductive material adjacent to and in contact with the recessed surfaces; and   an adhesive or a refractive-index matching material comprising a first surface and a second surface, the first surface contacting the structured surface region and the second surface being parallel to the major surface contour of the transparent substrate, wherein the remainder of the structured surface region is substantially free of the electrically conductive material.   
     
     
         2 . The article of  claim 1 , wherein the electrically conductive material is a two-dimensional network of lines or a series of parallel lines, wherein the lines have a width is in a range of 10 nanometers to 500 micrometers. 
     
     
         3 . The article of  claim 1 , wherein the electrically conductive material is in the form of a two-dimensional network of lines, wherein an area percentage of the structured surface region that is covered by electrically conductive material is in a range of 0.01 to 50 percent. 
     
     
         4 . The article of  claim 1 , wherein a difference between the index of refraction of the adhesive or the refractive index-matching material and the index of refraction of the substrate is less than or equal to 0.2. 
     
     
         5 . The article of  claim 1 , wherein the transparent substrate is a microreplicated polymer film.

Join the waitlist — get patent alerts

Track US2014199523A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.