Mems sensor

Abstract

There is provided a MEMS sensor including a signal processing LSI equipped with a temperature sensor for measuring temperature of a sensor, and a MEMS sensor chip overlaid on the signal processing LSI, the MEMS sensor chip being mounted on a heat generating part of the signal processing LSI. This MEMS sensor decreases the effects caused by thermally triggered changes in temperature characteristics.

1 . A MEMS sensor comprising:
 a signal processing LSI equipped with a temperature sensor for measuring temperature of a sensor; and   a MEMS sensor chip overlaid on said signal processing LSI, wherein   said MEMS sensor chip is mounted on a heat generating part of said signal processing LSI.   
     
     
         2 . A MEMS sensor according to  claim 1 , wherein
 said MEMS sensor chip is an acceleration sensor.   
     
     
         3 . A MEMS sensor according to  claim 1 , wherein
 said MEMS sensor chip is an angular velocity sensor.   
     
     
         4 . A MEMS sensor according to  claim 1 , wherein
 said MEMS sensor chip is made up of an acceleration sensor and an angular velocity sensor.   
     
     
         5 . A MEMS sensor according to  claim 1 , wherein
 said MEMS sensor chip is made up of a biaxial acceleration sensor and an angular velocity sensor.   
     
     
         6 . A MEMS sensor according to  claim 1 , wherein
 said MEMS sensor chip is made up of a triaxial acceleration sensor and an angular velocity sensor.   
     
     
         7 . A MEMS sensor according to  claim 1 , wherein
 said temperature sensor is disposed on the position that bears thermal resistance and thermal capacity equivalent to the thermal resistance and thermal capacity in effect between the heat generating part of said signal processing LSI and a sensing part of said MEMS sensor.   
     
     
         8 . A MEMS sensor according to  claim 1 , wherein
 said temperature sensor is disposed on the position that bears thermal resistance and thermal capacity with the same proportions as those of the thermal resistance and thermal capacity in effect between the heat generating part of said signal processing LSI and a sensing part of said MEMS sensor.