Cooling head and electronic apparatus

Abstract

A cooling head includes: a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant; a second refrigerant flow channel configured to flow the refrigerant; and at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other.

What is claimed is: 
     
         1 . A cooling head comprising:
 a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant;   a second refrigerant flow channel configured to flow the refrigerant; and   at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other.   
     
     
         2 . The cooling head according to  claim 1 , wherein the first refrigerant flow channel and the second refrigerant flow channel communicates with each other without a nozzle. 
     
     
         3 . The cooling head according to  claim 1 , wherein a downstream end of the second refrigerant flow channel in a second flow direction of refrigerant in the second refrigerant flow channel is blocked. 
     
     
         4 . The cooling head according to  claim 1 , wherein the second refrigerant flow channel is provided on the side of the first refrigerant flow channel opposite to the side in contact with the object. 
     
     
         5 . The cooling head according to  claim 1 , wherein the second refrigerant flow channel includes a plurality of flow channels for the object. 
     
     
         6 . The cooling head according to  claim 5 , wherein the plurality of flow channels extend parallel to each other. 
     
     
         7 . The cooling head according to  claim 5 , wherein the at least one communication hole is shared by at least two of the plurality of flow channels. 
     
     
         8 . The cooling head according to  claim 7 , wherein the at least one communication hole is formed so as to be elongate in a direction across the first flow direction. 
     
     
         9 . The cooling head according to  claim 1 , wherein the at least one communication hole includes a plurality of communication holes for the object, and the plurality of communication holes are arranged in the first flow direction. 
     
     
         10 . The cooling head according to  claim 1 , wherein the at least one communication hole is provided so as to correspond to the position of a hot spot having a large amount of heat generation of the object or is provided on an upstream side of the position of the hot spot. 
     
     
         11 . The cooling head according to  claim 1 , further comprising, a first flow channel member in which the first refrigerant flow channel is formed; and
 a second flow channel member in which the second refrigerant flow channel is formed so as to form a stacked structure.   
     
     
         12 . The cooling head according to  claim 1 , wherein the refrigerant in the second refrigerant flow channel is merged with the refrigerant flowing through the first refrigerant flow channel at a communication position with the first refrigerant flow channel and flows to the downstream side. 
     
     
         13 . An electronic apparatus comprising:
 an electronic device; and   a cooling head configured to cool the electronic device, wherein the cooling head includes:   a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant;   a second refrigerant flow channel configured to flow the refrigerant; and   at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other.   
     
     
         14 . The electronic apparatus according to  claim 13 , wherein a downstream end of the second refrigerant flow channel in a second flow direction of refrigerant in the second refrigerant flow channel is blocked. 
     
     
         15 . The electronic apparatus according to  claim 13 , wherein the second refrigerant flow channel is provided on the side of the first refrigerant flow channel opposite to the side in contact with the object. 
     
     
         16 . The electronic apparatus according to  claim 13 , wherein the second refrigerant flow channel includes a plurality of flow channels for the object. 
     
     
         17 . The electronic apparatus according to  claim 13 , wherein the at least one communication hole includes a plurality of communication holes for the object, and the plurality of communication holes are arranged in the first flow direction. 
     
     
         18 . The electronic apparatus according to  claim 13 , wherein the at least one communication hole is provided so as to correspond to the position of a hot spot having a large amount of heat generation of the object or is provided on an upstream side of the position of the hot spot. 
     
     
         19 . The electronic apparatus according to  claim 13 , further comprising, a first flow channel member in which the first refrigerant flow channel is formed; and
 a second flow channel member in which the second refrigerant flow channel is formed so as to form a stacked structure.   
     
     
         20 . The electronic apparatus according to  claim 13 , wherein the refrigerant in the second refrigerant flow channel is merged with the refrigerant flowing through the first refrigerant flow channel at a communication position with the first refrigerant flow channel and flows to the downstream side.