Substrate cleaning apparatus and polishing apparatus

Abstract

A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

What is claimed is: 
     
         1 . A substrate cleaning apparatus, comprising:
 a substrate holder for holding and rotating a substrate;   a chemical liquid nozzle for supplying a chemical liquid onto the substrate;   a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and   a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate,   wherein the chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and   the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.   
     
     
         2 . The substrate cleaning apparatus according to  claim 1 , wherein the moving mechanism includes:
 an arm for holding the chemical liquid nozzle and the two-fluid nozzle; and   an arm rotating device for causing the arm to pivot.   
     
     
         3 . The substrate cleaning apparatus according to  claim 1 , wherein a movement speed of the chemical liquid nozzle and the two-fluid nozzle is lowered gradually as the chemical liquid nozzle and the two-fluid nozzle approach the periphery of the substrate. 
     
     
         4 . A polishing apparatus, comprising:
 a polishing section for polishing a substrate; and   the substrate cleaning apparatus according to  claim 1  for cleaning the polished substrate.