US2014187714A1PendingUtilityA1
Sealant composition for electronic device
Est. expirySep 9, 2031(~5.1 yrs left)· nominal 20-yr term from priority
H10W 74/15H10W 90/734H10W 90/724H10W 72/354H10W 74/127H10W 74/47H10W 74/012C09J 133/24C09J 11/06C08F 222/402C08F 222/40C09J 135/02
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Claims
Abstract
The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
Claims
exact text as granted — not AI-modified1 . A sealant composition for electronic device comprising:
(a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
2 . The composition according to claim 1 , further comprising a radical initiator.
3 . The composition according to claim 1 , further comprising (b) a maleimide compound.
4 . The composition according to claim 3 , wherein the maleimide compound (b) comprises a bismaleimide.
5 . The composition according to claim 1 , which is used as an underfill sealant.
6 . The composition according to claim 1 , which is used in flip chip mounting.
7 . An electronic device comprising a cured product of the composition according to claim 1 .
8 . An electronic appliance comprising the electronic device according to claim 7 .Join the waitlist — get patent alerts
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