US2014183706A1PendingUtilityA1

Dielectric Films Comprising Silicon And Methods For Making Same

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Assignee: AIR PROD & CHEMPriority: Mar 13, 2009Filed: Mar 11, 2014Published: Jul 3, 2014
Est. expiryMar 13, 2029(~2.6 yrs left)· nominal 20-yr term from priority
Inventors:Liu YangManchao XiaoKirk Scott CuthillBing HanMark Leonard O'Neill
H10P 14/6339H10P 14/69215C23C 16/401C23C 16/308C23C 16/30H01L 21/02164H01L 21/0228
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Claims

Abstract

Described herein are methods of forming dielectric films comprising silicon, such as, but not limited to, silicon oxide, silicon oxycarbide, silicon carbide, and combinations thereof, that exhibit at least one of the following characteristics: low wet etch resistance, a dielectric constant of 6.0 or below, and/or can withstand a high temperature rapid thermal anneal process. Also disclosed herein are the methods to form dielectric films or coatings on an object to be processed, such as, for example, a semiconductor wafer.

Claims

exact text as granted — not AI-modified
1 - 10 . (canceled) 
     
     
         11 . A method for forming a dielectric film on at least one surface of a substrate, the method comprising:
 providing the at least one surface of the substrate in a reaction chamber;   providing at least one silicon precursor selected from the group consisting of 1,3-disilabutane and derivatives thereof; 1,4-disilylbenzene and derivatives thereof; 1,3-disilylbenzene and derivatives thereof; 1,3-disilacyclobutane and derivatives thereof; 1,4-disilacyclohexane and derivatives thereof; and combinations thereof;   providing an oxygen source in a molecular amount less than a 1:1 ratio to the silicon precursor; and   forming the dielectric film on the at least one surface by a deposition process chosen from a chemical vapor deposition process and an atomic layer deposition process, wherein the dielectric film comprises carbon and the carbon is not substantially associated with methyl substituents bonded to a silicon atom.   
     
     
         12 . The method of  claim 11  wherein the silicon precursor is 1,3-disilabutane and derivatives thereof. 
     
     
         13 . The method of  claim 11  wherein the silicon precursor is 1,4-disilylbenzene and derivatives thereof. 
     
     
         14 . The method of  claim 11  wherein the silicon precursor is 1,3-disilylbenzene and derivatives thereof. 
     
     
         15 . The method of  claim 11  wherein the silicon precursor is 1,3-disilacyclobutane and derivatives thereof. 
     
     
         16 . The method of  claim 11  wherein the silicon precursor is 1,4-disilacyclohexane and derivatives thereof. 
     
     
         17 . The method of  claim 11  wherein the oxygen source comprises oxygen. 
     
     
         18 . The method of  claim 11  wherein the oxygen source comprises ozone. 
     
     
         19 . The method of  claim 11  wherein the dielectric film comprises silicon oxycarbide. 
     
     
         20 . A method of forming a dielectric film comprising silicon oxide via an atomic layer deposition (ALD) process, the method comprising the steps of:
 a. providing a substrate in an ALD reactor;   b. providing in the ALD reactor an at least one silicon precursor selected from the group consisting of 1,3-disilabutane and derivatives thereof; 1,4-disilylbenzene and derivatives thereof; 1,3-disilylbenzene and derivatives thereof; 1,3-disilacyclobutane and derivatives thereof; 1,4-disilacyclohexane and derivatives thereof; and combinations thereof;   c. purging the ALD reactor with an inert gas;   d. providing an oxygen source in the ALD reactor, in a molecular amount less than a 1:1 ratio to the silicon precursor;   e. purging the ALD reactor with an inert gas; and   f. repeating the steps b through e until a desired thickness of the dielectric film is obtained, wherein the dielectric film comprises carbon and the carbon is not substantially associated with methyl substituents bonded to a silicon atom.   
     
     
         21 . The method of  claim 20  wherein the silicon precursor is 1,3-disilabutane and derivatives thereof. 
     
     
         22 . The method of  claim 20  wherein the silicon precursor is 1,4-disilylbenzene and derivatives thereof. 
     
     
         23 . The method of  claim 20  wherein the silicon precursor is 1,3-disilylbenzene and derivatives thereof. 
     
     
         24 . The method of  claim 20  wherein the silicon precursor is 1,3-disilacyclobutane and derivatives thereof. 
     
     
         25 . The method of  claim 20  wherein the silicon precursor is 1,4-disilacyclohexane and derivatives thereof. 
     
     
         26 . A method of forming a dielectric film comprising silicon oxide onto at least a surface of a substrate using a chemical vapor deposition (CVD) process, the method comprising:
 a. providing a substrate in a CVD reactor;   b. introducing into the CVD reactor an at least one silicon precursor selected from the group consisting of 1,3-disilabutane and derivatives thereof; 1,4-disilylbenzene and derivatives thereof; 1,3-disilylbenzene and derivatives thereof; 1,3-disilacyclobutane and derivatives thereof; 1,4-disilacyclohexane and derivatives thereof; and combinations thereof;   c. providing an oxygen source into the CVD reactor, in a molecular amount less than a 1:1 ratio to the silicon precursor; and   d. forming the silicon oxide dielectric film on the at least one surface, wherein the dielectric film comprises carbon and the carbon is not substantially associated with methyl substituents bonded to a silicon atom.   
     
     
         27 . The method of  claim 26  wherein the silicon precursor is 1,3-disilabutane and derivatives thereof. 
     
     
         28 . The method of  claim 26  wherein the silicon precursor is 1,4-disilylbenzene and derivatives thereof. 
     
     
         29 . The method of  claim 26  wherein the silicon precursor is 1,3-disilylbenzene and derivatives thereof. 
     
     
         30 . The method of  claim 26  wherein the silicon precursor is 1,3-disilacyclobutane and derivatives thereof. 
     
     
         31 . The method of  claim 26  wherein the silicon precursor is 1,4-disilacyclohexane and derivatives thereof. 
     
     
         32 . A dielectric film made by a method comprising the steps of:
 providing the at least one surface of the substrate in a reaction chamber;   providing at least one silicon precursor selected from the group consisting of 1,3-disilabutane and derivatives thereof; 1,4-disilylbenzene and derivatives thereof; 1,3-disilylbenzene and derivatives thereof; 1,3-disilacyclobutane and derivatives thereof; 1,4-disilacyclohexane and derivatives thereof; and combinations thereof;   providing an oxygen source in a molecular amount less than a 1:1 ratio to the silicon precursor; and   forming the dielectric film on the at least one surface by a deposition process chosen from a chemical vapor deposition process and an atomic layer deposition process; and   subjecting the dielectric film to a high temperature spike anneal up to 1000° C., wherein the dielectric film comprises carbon and the carbon is not substantially associated with methyl substituents bonded to a silicon atom.   
     
     
         33 . The dielectric film of  claim 32  wherein the amount of carbon in the dielectric film does not substantially change after the dielectric film is subjected to a high temperature spike anneal up to 1000° C. 
     
     
         34 . The dielectric film of  claim 32  wherein the oxygen source comprises oxygen. 
     
     
         35 . The dielectric film of  claim 32  wherein the oxygen source comprises ozone.

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