Deposition apparatus
Abstract
A deposition apparatus includes a vacuum chamber, a substrate disposed in the vacuum chamber, a deposition source disposed in the vacuum chamber and facing the substrate to provide a deposition material onto the substrate, a laser oscillator generating a first laser beam, and an optical unit connected to a first side of the vacuum chamber and splitting the first laser beam to generate a plurality of mask laser beams. The mask laser beams are irradiated into the vacuum chamber to be disposed between the substrate and the deposition source. The deposition material making contact with the mask laser beams is oxidized, and the deposition material passing through the mask laser beams is deposited on the substrate.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A deposition apparatus comprising:
a vacuum chamber; a substrate disposed in the vacuum chamber; a deposition source disposed in the vacuum chamber and facing the substrate to provide a deposition material onto the substrate; a laser oscillator that generates a first laser beam; and an optical unit connected to a first side of the vacuum chamber and splitting the first laser beam to generate a plurality of mask laser beams, wherein the mask laser beams are irradiated into the vacuum chamber to be disposed between the substrate and the deposition source, the deposition material making contact with the mask laser beams is oxidized, and the deposition material passing through the mask laser beams is deposited on the substrate.
2 . The deposition apparatus of claim 1 , wherein the mask laser beams are disposed to be spaced apart from the substrate in a direction vertical to the substrate.
3 . The deposition apparatus of claim 2 , wherein the mask laser beams are spaced apart from the substrate in the direction vertical to the substrate by a distance of about 0.1 mm to about 1.0.
4 . The deposition apparatus of claim 2 , wherein the mask laser beams are arranged substantially in parallel to the substrate and spaced apart from each other at regular intervals.
5 . The deposition apparatus of claim 1 , wherein the optical unit comprises:
a beam expander configured to expand the first laser beam; a beam splitter configured to split the expanded first laser beam to generate a plurality of second laser beams; and a beam controller configured to control a width of a corresponding second laser beam of the second laser beams and a distance between the second laser beams to generate the mask laser beams.
6 . The deposition apparatus of claim 5 , wherein the beam expander comprises:
a concave lens configured to expand the first laser beam; and a convex lens configured to provide the expanded first laser beam to the beam splitter.
7 . The deposition apparatus of claim 5 , wherein the beam splitter comprises a plurality of lens units configured to split the expanded first laser beam and generate the second laser beams.
8 . The deposition apparatus of claim 7 , wherein the beam controller comprises a plurality of collimating lens units respectively corresponding to the lens units, and each of the collimating lens units is configured to control the width of the corresponding second laser beam provided from a corresponding lens unit of the lens units and the distance between the second laser beams to generate the mask laser beams.
9 . The deposition apparatus of claim 1 , wherein the deposition source comprises:
a crucible configured to heat the deposition material filled therein to evaporate the deposition material; and a plurality of nozzles configured to spray the evaporated deposition material onto the substrate.
10 . The deposition apparatus of claim 1 , further comprising an optical cable to connect the laser oscillator to the optical unit and to provide the first laser beam to the optical unit.
11 . The deposition apparatus of claim 1 , further comprising a light receiver disposed at a second side of the vacuum chamber, which is opposite to the first side, to receive the mask laser beams.
12 . A method of depositing a deposition material onto a substrate, comprising:
disposing the substrate in a vacuum chamber; generating a first laser beam; splitting the first laser beam to generate a plurality of mask laser beams; providing the deposition material; and irradiating the mask laser beams into the vacuum chamber onto the deposition material, such that the deposition material making contact with the mask laser beams is oxidized, and the deposition material passing through the mask laser beams is deposited on the substrate.
13 . The method of claim 12 , wherein the mask laser beams are disposed to be spaced apart from the substrate in a direction vertical to the substrate.
14 . The method of claim 13 , wherein the mask laser beams are spaced apart from the substrate in the direction vertical to the substrate by a distance of about 0.1 mm to about 1.0.
15 . The method of claim 13 , wherein the mask laser beams are arranged substantially in parallel to the substrate and spaced apart from each other at regular intervals.
16 . The method of claim 12 , wherein splitting the first laser beam comprises:
expanding the first laser beam; splitting the expanded first laser beam to generate a plurality of second laser beams; and controlling a width of a corresponding second laser beam of the second laser beams and a distance between the second laser beams to generate the mask laser beams.
17 . The method of claim 12 , wherein providing the deposition material comprises:
heating the deposition material to evaporate the deposition material; and spraying the evaporated deposition material onto the substrateJoin the waitlist — get patent alerts
Track US2014178605A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.