Integrated circuit package and method of manufacture

Abstract

An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe.

What is claimed is: 
     
         1 - 20 . (canceled) 
     
     
         21 . An integrated circuit package comprising:
 a lead frame having an upper surface, an oppositely disposed lower surface and at least one opening extending through the leadframe from said upper surface to said lower surface;   an integrated circuit device attached to a portion of said upper surface of said leadframe; and   a shunt positioned at least partially in said opening, wherein, said shunt is not in contact with any portion of said leadframe.   
     
     
         22 . The integrated circuit package of  claim 21  and further wherein said integrated circuit device is electrically connected to said shunt and to said leadframe. 
     
     
         23 . The integrated circuit device of  claim 22  and further wherein said integrated circuit device is electrically connected to said shunt and to said leadframe by wire bonds. 
     
     
         24 . The integrated circuit package of  claim 21  and further comprising:
 a molding material encompassing at least portions of said leadframe, said integrated circuit device and said shunt. 
 
     
     
         25 . The integrated circuit package of  claim 21  and further wherein said shunt is formed from an alloy comprising copper, manganese, and nickel.