Method of manufacturing a printed circuit board

Abstract

A method of manufacturing a printed circuit board, according to one embodiment, includes forming a circuit pattern and a via pad, which is disposed by being spaced apart from the circuit pattern and has concavo-convex patterns, on a first insulating layer; forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon; forming a via hole by etching a portion of the second insulating layer on the via pad; and forming a copper foil layer on the second insulating layer having the via hole formed therein.

What is claimed is: 
     
         1 . A method of manufacturing a printed circuit board comprising:
 forming a circuit pattern and a via pad, which is disposed by being spaced apart from the circuit pattern and has concavo-convex patterns, on a first insulating layer;   forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon;   forming a via hole by etching a portion of the second insulating layer on the via pad; and   forming a copper foil layer on the second insulating layer having the via hole formed therein.   
     
     
         2 . A method of manufacturing a printed circuit board comprising:
 forming a circuit pattern by etching a portion of a first insulating layer and forming a via pad with concavo-convex patterns by etching a portion of the first insulating layer spaced apart from the circuit pattern;   forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon;   forming a via hole by etching a portion of the second insulating layer on the via pad; and   forming a copper foil layer on the second insulating layer having the via hole formed therein.   
     
     
         3 . The method according to  claim 1 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed by etching portions of the via pad through laser irradiation. 
     
     
         4 . The method according to  claim 1 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed in at least one of a circular shape, a hexagonal shape, a square shape, a spiral shape, and a shape formed by crossing a plurality of diagonal lines. 
     
     
         5 . The method according to  claim 1 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed by etching some or all of the thickness of the via pad. 
     
     
         6 . The method according to  claim 1 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed by etching the via pad and portions of the first insulating layer formed on a lower surface of the via pad. 
     
     
         7 . The method according to  claim 1 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are regularly formed. 
     
     
         8 . The method according to  claim 2 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed by etching portions of the via pad through laser irradiation. 
     
     
         9 . The method according to  claim 2 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed in at least one of a circular shape, a hexagonal shape, a square shape, a spiral shape, and a shape formed by crossing a plurality of diagonal lines. 
     
     
         10 . The method according to  claim 2 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed by etching some or all of the thickness of the via pad. 
     
     
         11 . The method according to  claim 2 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are formed by etching the via pad and portions of the first insulating layer formed on a lower surface of the via pad. 
     
     
         12 . The method according to  claim 2 , wherein in forming the via pad with the concavo-convex patterns, the concavo-convex patterns are regularly formed.