Wiring substrate

Abstract

A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

What is claimed is: 
     
         1 . A wiring substrate, comprising:
 a wiring board that has a main face and a side face substantially perpendicular to the main face;   a circuit pattern that is formed on the main face of the wiring board;   a soaking plate that is disposed in an intermediate layer of the wiring board; and   a plurality of protruding terminals that are disposed in the intermediate layer and are projected outwardly from the side face,   wherein the protruding terminals are electrically connected in the intermediate layer to each other.   
     
     
         2 . The wiring substrate according to  claim 1 , further comprising:
 other protruding terminal that is disposed in the intermediate layer and is projected outwardly from the side face,   wherein the other protruding terminal is separated from the plurality of protruding terminals.   
     
     
         3 . The wiring substrate according to  claim 1 , wherein a through hole for electrically connecting the protruding terminals to the circuit pattern is communicated from the main face to the intermediate layer. 
     
     
         4 . The wiring substrate according to  claim 1 , wherein the soaking plate, which is comprised of a conductive material, is electrically connected to the circuit pattern.