Cleaning device, cleaning method, and method of manufacturing the cleaning device

Abstract

Provided are a cleaning device that may be applied to a manufacturing equipment without stopping operations of the equipment, a cleaning method, and a method of manufacturing a device. The cleaning device includes: a frame substrate configured to frame the cleaning device; a first functional membrane on a first surface of the frame substrate; and a second functional membrane on a second surface of the frame substrate, which is opposite to the first surface. The cleaning method includes: positioning a cleaning device including a frame substrate and functional membranes formed on opposite surfaces of the frame substrate on a support configured to support a substrate, during a semiconductor manufacturing process or a display manufacturing process on the substrate; maintaining the positioning of the cleaning device on the support for a predetermined time period; and removing the cleaning device from the support.

What is claimed is: 
     
         1 . A cleaning device comprising:
 a frame substrate configured to frame the cleaning device;   a first functional membrane on a first surface of the frame substrate; and   a second functional membrane on a second surface of the frame substrate, wherein the second surface is opposite to the first surface.   
     
     
         2 . The cleaning device of  claim 1 , wherein the first functional membrane and the second functional membrane are a same material. 
     
     
         3 . The cleaning device of  claim 1 , wherein the first functional membrane and the second functional membrane are different materials from each other. 
     
     
         4 . The cleaning device of  claim 1 , wherein the first and second functional membranes may include at least one of an organic material, an inorganic material, and a polymer material. 
     
     
         5 . The cleaning device of  claim 1 , wherein at least one of the frame substrate, the first functional membrane, and the second functional membrane includes a chemical action layer or is physically or chemically treated. 
     
     
         6 . The cleaning device of  claim 1 , wherein the cleaning device has one of a horizontal cross-section corresponding to a surface shape of a device that is to be cleaned, and a horizontal cross-section of a substrate supported by the device that is to be cleaned. 
     
     
         7 . The cleaning device of  claim 1 , wherein at least one of the first functional membrane and the second functional membrane has a multi-layered structure. 
     
     
         8 . The cleaning device of  claim 1 , wherein a pattern is formed on a surface of at least one of the first functional membrane and the second functional membrane. 
     
     
         9 . The cleaning device of  claim 1 , wherein the frame substrate includes a plurality of protrusions configured to improve a coupling force to the first functional membrane and the second functional membrane. 
     
     
         10 . A cleaning method comprising:
 positioning a cleaning device including a frame substrate, a first functional membrane and a second functional membrane, the first functional membrane and the second functional membrane on opposite surfaces of the frame substrate, on a support configured to support a substrate, during a semiconductor manufacturing process or a display manufacturing process on the substrate;   maintaining the positioning of the cleaning device on the support for a predetermined time period; and   removing the cleaning device from the support.   
     
     
         11 . The cleaning method of  claim 10 , wherein
 the first functional membrane and the second functional membrane are a same material, and   after contacting the first functional membrane to the support a predetermined number of times, the cleaning device is turned over to contact the second functional membrane to the support, the first functional membrane on a first surface of the frame substrate and the second functional membrane on a second surface of the frame substrate.   
     
     
         12 . The cleaning method of  claim 10 , wherein
 the first functional membrane and the second functional membrane are different materials from each other,   the first functional membrane cleans the support, and   the second functional membrane does not contact the support and performs a function that is different from the cleaning of the support.   
     
     
         13 . The cleaning method of  claim 10 , wherein cleaning is performed without stopping operations of an apparatus performing the semiconductor manufacturing process or the display manufacturing process on the substrate. 
     
     
         14 . The cleaning method of  claim 13 , wherein the cleaning is performed without changing processing conditions in the apparatus. 
     
     
         15 . The cleaning method of  claim 10 , wherein the cleaning device is configured to perform a cleaning function to clean the support and also to perform at least one additional function selected from the group consisting of contamination control, temperature stabilization, composition state maintenance, sampling, degassing, and recovery of hydrophobicity of the support in an apparatus in which the support is disposed. 
     
     
         16 . The cleaning method of  claim 10 , wherein the maintaining of the positioning of the cleaning device includes adhering the cleaning device to the support by a voltage application or a vacuum absorption. 
     
     
         17 . The cleaning method of  claim 10 , further comprising cleaning the support using a cleaning gas or a cleaning solution before the positioning the cleaning device or after the removing the cleaning device. 
     
     
         18 . A method of manufacturing a device, the method comprising:
 performing processes with respect to a substrate on a support configured to support the substrate, during a semiconductor manufacturing process or a display manufacturing process;   determining whether the support needs to be cleaned;   when the support needs to be cleaned, cleaning the support using a cleaning device including a frame substrate, and a first functional membrane and a second functional membrane formed on opposite surfaces of the frame substrate; and   positioning a new substrate on the support.   
     
     
         19 . The method of  claim 18 , wherein the cleaning of the support comprises:
 positioning the cleaning device on the support;   maintaining the positioning of the cleaning device on the support for a predetermined time period; and   removing the cleaning device from the support.   
     
     
         20 . The method of  claim 18 , wherein when the first functional membrane and the second functional membrane are a same material, after contacting the first functional membrane to the support by a predetermined number of times, the cleaning device is turned over to contact the second functional membrane to the support, the first functional membrane on a first surface of the frame substrate and the second functional membrane on a second surface of the frame substrate. 
     
     
         21 . The method of  claim 18 , wherein when the first functional membrane and the second functional membrane are different materials from each other, the first functional membrane contacts and cleans the support, and the second functional membrane performs a function that is different from the cleaning of the support. 
     
     
         22 . The method of  claim 18 , wherein the cleaning is performed without stopping operations of an apparatus performing the semiconductor manufacturing process or the display manufacturing process on the substrate. 
     
     
         23 . The method of  claim 18 , wherein the determining whether the support needs to be cleaned further comprises:
 determining if at least one of a predetermined number of processing times with respect to the substrate and a predetermined condition in a processing apparatus is satisfied.   
     
     
         24 . A method of manufacturing a cleaning device, the method comprising:
 preparing a frame substrate configuring a frame of the cleaning device;   applying a liquid polymer precursor on each of opposite surfaces of the frame substrate using at least one of a coating method, a molding method, an imprinting method, a printing method, and a pulling method; and   forming functional membranes on the opposite surfaces of the frame substrate by curing the liquid polymer precursor.   
     
     
         25 . The method of  claim 24 , wherein at least one of the frame substrate and the functional membranes on the opposite surfaces of the frame substrate includes a chemical action layer or is physically or chemically treated. 
     
     
         26 . A cleaning device, comprising:
 a substrate;   a first functional membrane on a first surface of the substrate, the first functional membrane configured to clean; and   a second functional membrane on a second surface of the substrate opposite the first surface, the second functional membrane configured to one of clean, control contamination, stabilize temperature, maintain composition state, sample, remove unnecessary gas and reconstruct hydrophobicity.   
     
     
         27 . The cleaning device of  claim 26 , wherein the cleaning device is configured to withstand two or more semiconductor manufacturing processes or display manufacturing processes. 
     
     
         28 . A method of cleaning, the method comprising:
 performing a manufacturing process on a first semiconductor substrate;   performing the manufacturing process at least once on a cleaning device, the cleaning device including a first functional membrane configured to clean and including a second functional membrane, opposite the first functional membrane, configured to one of clean, control contamination, stabilize temperature, maintain composition state, sample, remove unnecessary gas and reconstruct hydrophobicity; and   performing the manufacturing process on a second semiconductor substrate.