Led structure with enhanced mirror reflectivity

Abstract

Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror. The barrier layer is smaller than the mirror, such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact is provided on the active region. In a further embodiment, the barrier layer is smaller than the mirror such that the periphery of the mirror is at least 40% free of the barrier layer, and the second contact is below the first contact and accessible from the bottom of the chip.

We claim: 
     
         1 . A LED chip, comprising:
 one or more LEDs mounted on a submount, with each of said LEDs comprising;
 an active region; 
 a first contact below said active region, said first contact comprising a reflective mirror; 
 a barrier layer adjacent said mirror, said barrier layer is at most the same size as said mirror, such that a majority of said barrier does not extend beyond the periphery of said mirror; and 
 an insulator adjacent said barrier layer and adjacent portions of said mirror not contacted by said active region or by said barrier layer, such that the barrier is between said insulator and said mirror. 
   
     
     
         2 . The LED chip of  claim 1 , wherein said active region is comprised of alternating p-GaN and n-GaN layers. 
     
     
         3 . The LED chip of  claim 1 , wherein said active region is textured to enhance light extraction. 
     
     
         4 . The LED chip of  claim 1 , wherein said first contact comprises a p-contact, and said mirror is Ag-based. 
     
     
         5 . The LED chip of  claim 1 , wherein said barrier layer is comprised of a metal that is substantially less reflective than said mirror. 
     
     
         6 . The LED chip of  claim 1 , further comprising an insulator adjacent said barrier layer, active region, and each portion of said mirror not contacted by said barrier layer. 
     
     
         7 . The LED chip of  claim 6 , further comprising a reflective metal layer below and adjacent to said insulator layer. 
     
     
         8 . The LED chip of  claim 7 , wherein said insulator and said reflective metal layer form a composite barrier that is significantly more reflective than said barrier layer, with the reflectivity of said composite barrier being >80% or >90%. 
     
     
         9 . The LED chip of  claim 7 , wherein said reflective metal layer comprises Al or Ag. 
     
     
         10 . The LED chip of  claim 1 , wherein said barrier layer is provided to prevent Ag migration of said mirror. 
     
     
         11 . The LED chip of  claim 1 , wherein said barrier layer comprises a step or transition. 
     
     
         12 . The LED chip of  claim 6 , wherein said insulator is provided to prevent Ag migration of said mirror and to have a low index of refraction. 
     
     
         13 . The LED chip of  claim 6 , wherein said insulator is comprised of an oxide, nitride, or oxynitride of elements Si or Al. 
     
     
         14 . The LED chip of  claim 6 , wherein said first and second layers are distinct. 
     
     
         15 . The LED chip of  claim 14 , wherein said first layer is for preventing Ag migration and said second layer is thicker than said first layer. 
     
     
         16 . The LED chip of  claim 15 , wherein said insulator is comprised of a third layer which is in contact with a reflective metal and is optimized for good adhesion to said reflective metal. 
     
     
         17 . The LED chip of  claim 1 , wherein said insulator comprises a first layer for preventing migration and a second layer having a low refractive index. 
     
     
         18 . The LED chip of  claim 1 , wherein said barrier layer is smaller than said mirror such that it does not extend beyond the periphery of said mirror. 
     
     
         19 . A LED chip, comprising:
 one or more LEDs mounted on a submount, with each of said LEDs comprising;
 an active region; 
 a first contact below said active region, said first contact comprising a reflective mirror; 
 a barrier layer adjacent said mirror, said barrier layer at most the same size as said mirror such that a majority of it does not extend beyond the periphery of said mirror, wherein said barrier layer and mirror are between said active region and said submount; and 
 an insulator adjacent said barrier layer and adjacent portions of said mirror not contacted by said active region or by said barrier layer. 
   
     
     
         20 . The LED chip of  claim 19 , wherein said first contact comprises a p-contact, and said mirror is Ag-based. 
     
     
         21 . The LED chip of  claim 19 , wherein said barrier layer is comprised of a metal that is substantially less reflective than said mirror, said barrier layer further smaller than said mirror. 
     
     
         22 . The LED chip of  claim 19 , further comprising a reflective metal layer below and adjacent to said insulator layer, wherein said insulator and said reflective metal layer form a composite barrier that is significantly more reflective than said barrier layer, with the reflectivity of said composite barrier being >80% or >90%. 
     
     
         23 . The LED chip of  claim 22 , wherein said reflective metal layer comprises Al or Ag. 
     
     
         24 . The LED chip of  claim 19 , wherein said barrier layer and said insulator are provided to prevent Ag migration of said mirror. 
     
     
         25 . The LED chip of  claim 19 , wherein said insulator is further provided to have a low index of refraction. 
     
     
         26 . The LED chip of  claim 19 , wherein said insulator is comprised of two or more distinct layers, with a first layer provided for preventing Ag migration, a second thicker layer having a low refractive index. 
     
     
         27 . The LED chip of  claim 26 , wherein said insulator is comprised of an optional third layer which is in contact with a reflective metal and is optimized for good adhesion to said reflective metal. 
     
     
         28 . The LED chip of  claim 19 , further comprising a second contact comprising a n-contact, said n-contact comprised of Al. 
     
     
         29 . The LED chip of  claim 19 , wherein the periphery of said chip is at least 40% free of said barrier layer. 
     
     
         30 . The LED chip of  claim 19 , wherein said barrier layer comprises a step or transition. 
     
     
         31 . An LED chip, comprising:
 one or more LEDs, with each of said LEDs comprising:
 an active region comprising a n-GaN and a p-GaN layer; 
 a first contact below said active region, said first contact comprising a reflective mirror; 
 a barrier layer adjacent said mirror, said barrier layer smaller than said mirror such that the periphery of said mirror is at least 40% free of said barrier layer; and 
 a second contact below said first contact, with said second contact accessible from the bottom of said chip. 
   
     
     
         32 . The LED chip of  claim 31 , wherein said first contact is a p-contact having a bond pad exposed at the top of said chip. 
     
     
         33 . The LED chip of  claim 31 , wherein said second contact is an n-contact, said LED chip further comprising vias for providing electrical connection to said second contact. 
     
     
         34 . The LED chip of  claim 31 , wherein said first contact comprises a p-contact, and said mirror is Ag-based. 
     
     
         35 . The LED chip of  claim 31 , wherein said barrier layer is comprised of a metal that is substantially less reflective than said mirror. 
     
     
         36 . The LED chip of  claim 31 , further comprising a reflective metal layer below and adjacent to said insulator layer, wherein said insulator and said reflective metal layer form a composite barrier that is significantly more reflective than said barrier layer, with the reflectivity of said composite barrier being >80% or >90%. 
     
     
         37 . The LED chip of  claim 31 , wherein said insulator is further provided to have a low index of refraction. 
     
     
         38 . The LED chip of  claim 31 , wherein said insulator is comprised of two or more distinct layers, with a first layer provided for preventing Ag migration, a second thicker layer having a low refractive index, and an optional third layer which is in contact with a reflective metal and is optimized for good adhesion to said reflective metal. 
     
     
         39 . The LED chip of  claim 31 , wherein said barrier layer comprises a step or transition.