US2014159250A1PendingUtilityA1

Bbul top side substrate layer enabling dual sided silicon interconnect and stacking flexibility

48
Individually held — no corporate assignee on recordPriority: Dec 31, 2011Filed: Dec 31, 2011Published: Jun 12, 2014
Est. expiryDec 31, 2031(~5.4 yrs left)· nominal 20-yr term from priority
Inventors:Robert M. Nickerson
H10W 90/724H10W 90/722H10W 72/9413H10W 72/874H10W 72/0198H10W 72/072H10W 72/29H10W 70/099H10W 70/093H10W 90/00H10W 72/90H10W 72/019H10W 70/688H10W 70/685H10W 70/614H10W 70/65H10W 70/60H10W 70/09H05K 3/4682H05K 1/186H05K 2203/1469H05K 2201/10674H05K 1/185H01L 24/03H01L 23/49838H01L 24/06
48
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Claims

Abstract

An apparatus including a die including a first side and an opposite second side including a device side with contact points; and a build-up carrier including at least one layer of conductive material disposed on a first side of the die, and a plurality of alternating layers of conductive material and dielectric material disposed on the second side of the die, wherein the at least one layer of conductive material on the first side of the die is coupled to at least one of (1) at least one of the alternating layers of conductive material on the second side of the die and (2) at least one of the contact points of the die. A method including forming a first portion of a build-up carrier adjacent one side of a die, and forming a second portion of the build-up carrier adjacent another side of the die.

Claims

exact text as granted — not AI-modified
1 . An apparatus comprising:
 a die comprising a first side and an opposite second side comprising a device side with contact points; and   a build-up carrier comprising:
 at least one layer of conductive material disposed on a first side of the die, and 
 a plurality of alternating layers of conductive material and dielectric material disposed on the second side of the die, wherein the at least one layer of conductive material on the first side of the die is coupled to at least one of (1) at least one of the alternating layers of conductive material on the second side of the die and (2) at least one of the contact points of the die. 
   
     
     
         2 . The apparatus of  claim 1 , wherein the at least one layer of conductive material on the first side of the die is separated from the die by a dielectric material. 
     
     
         3 . The apparatus of  claim 1 , wherein the at least one layer of conductive material on the first side is electrically coupled to at least one of the plurality of layers of conductive material on the second side. 
     
     
         4 . The apparatus of  claim 1 , wherein the contact points of the die are coupled to the at least one layer of conductive material. 
     
     
         5 . The apparatus of  claim 4 , wherein the contacts of the die that are coupled to the at least one layer of conductive material are coupled to conductive vias from the second side of the die to the first side. 
     
     
         6 . A method comprising:
 forming a first portion of a build-up carrier adjacent a die, the die comprising a first side and an opposite second side comprising a device side with contact points, the build-up carrier comprising a plurality of alternating layers of conductive material and dielectric material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and   forming a second portion of the build-up carrier adjacent the first side of the die, the second portion comprising at least one layer of conductive material that is coupled to one of (1) at least one of the alternating layers of conductive material on the first portion of the carrier and (2) at least one of the contact points.   
     
     
         7 . The method of  claim 6 , wherein, prior to forming a first portion of the build-up carrier, the method further comprises:
 forming a sacrificial substrate having a planar surface; and   positioning the die on the sacrificial substrate.   
     
     
         8 . The method of  claim 6 , wherein forming the second portion of the build-up carrier comprises separating the at least one layer of conductive material on the first side of the die from the die by a dielectric material. 
     
     
         9 . The method of  claim 6 , further comprising electrically coupling the at least one layer of conductive material on the first side comprises coupling to at least one of the plurality of layers of conductive material on the second side. 
     
     
         10 . The method of  claim 6 , further comprising coupling the contact points of the die to the at least one layer of conductive material. 
     
     
         11 . The method of  claim 10 , wherein the contacts of the die that are coupled to the at least one layer of conductive material are coupled to conductive vias from the second side of the die to the first side. 
     
     
         12 . An apparatus comprising:
 a package comprising a microprocessor disposed in a carrier,   the microprocessor comprising a first side and an opposite second side comprising a device side with contact points;   the carrier comprising:
 a first portion coupled to the second side of the microprocessor, the first portion comprising:
 a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the microprocessor; and 
 a plurality of accessible contacts; and 
 
 a second portion adjacent the first side of the microprocessor, the second portion comprising at least one layer of conductive material; and 
 a printed circuit board coupled to at least a portion of the plurality of accessible contacts of the carrier. 
   
     
     
         13 . The apparatus of  claim 12 , wherein the contact points of the microprocessor comprise a first plurality of contact points, the microprocessor further comprising a second plurality of contact points on a first side of the microprocessor, and second plurality of contact points are coupled to the at least one conductive layer of the second portion of the package. 
     
     
         14 . The apparatus of  claim 12 , wherein the plurality of accessible contacts of the first portion of the carrier comprise a first plurality of accessible contacts, and the second portion of the carrier further comprises:
 a second plurality of accessible contacts.   
     
     
         15 . The apparatus of  claim 14 , further comprising:
 a secondary device coupled to the second plurality of accessible contacts.   
     
     
         16 . The apparatus of  claim 15 , wherein the secondary device comprises at least one memory device. 
     
     
         17 . The apparatus of  claim 15 , wherein the secondary device comprises a package. 
     
     
         18 . The apparatus of  claim 15 , wherein the secondary device comprises a logic device.

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