Light-emitting device package and method of manufacturing the same

Abstract

A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.

1 . A light-emitting device package comprising:
 a metal layer;   an insulating layer disposed on the metal layer;   a first electrode pattern disposed on an edge portion of the insulating layer;   at least one light-emitting device chip disposed on the insulating layer;   at least one electrode pad disposed around the at least one light-emitting device chip on the insulating layer; and   a second electrode pattern disposed on the insulating layer and connecting the first electrode pattern and the at least one electrode pad to each other.   
     
     
         2 . The light-emitting device package of  claim 1 , further comprising a solder mask pattern disposed on an edge portion of the insulating layer and covering the first electrode pattern. 
     
     
         3 . The light-emitting device package of  claim 1 , wherein the second electrode pattern is formed of conductive ink. 
     
     
         4 . The light-emitting device package of  claim 1 , wherein the metal layer reflects light emitted from the at least one light-emitting device chip. 
     
     
         5 . The light-emitting device package of  claim 1 , further comprising a metal wire for electrically connecting the at least one light-emitting device chip and the at least one electrode pad to each other. 
     
     
         6 . The light-emitting device package of  claim 5 , wherein a plurality of light-emitting device chips are disposed on the insulating layer, and
 wherein the plurality of light-emitting device chips share the at least one electrode pad, and are connected with the at least one electrode pad by the metal wire.   
     
     
         7 . The light-emitting device package of  claim 1 , wherein the at least one electrode pad comprises a plurality of n-type electrode pads, and
 wherein the second electrode pattern comprises a continuous n-type electrode pattern that connects the plurality of n-type electrode pads to each other.   
     
     
         8 . The light-emitting device package of  claim 1 , wherein the at least one electrode pad comprises a plurality of p-type electrode pads, and
 wherein the second electrode pattern comprises a continuous p-type electrode pattern that connects the plurality of p-type electrode pads to each other.   
     
     
         9 . The light-emitting device package of  claim 1 , further comprising a dam surrounding the at least one light-emitting device chip on the insulating layer,
 wherein a phosphor layer is formed inside the dam.   
     
     
         10 . The light-emitting device package of  claim 9 , further comprising an optical lens disposed on the phosphor layer. 
     
     
         11 - 19 . (canceled)