Sensor, sensor system, portable sensor system, method of analyzing metal ions, mounting substrate, method of analyzing plating preventing chemical species, method of analyzing produced compound, and method of analyzing monovalent copper chemical species

Abstract

This invention provides a sensor having such a structure that the area in which a sensor electrode comes into contact with a liquid, a mist or a gas containing an analyte has been previously specified. The sensor comprises at least an electroconductive first electrode, an electroconductive second electrode, electroconductive first and second wirings connected to the first and second electrodes, and an insulating part for insulating the first and second wirings from each other and from a liquid, a mist or a gas containing the analyte. The insulating part is formed of an organic material. In the first and second electrodes, at least the surface, which comes into contact with a liquid, a mist or a gas containing the analyte, is formed of a material which is insoluble in a liquid or a mist containing the analyte, or is not attacked by a gas containing the analyte.

1 . A method of analyzing a compound produced from a copper plating solution during copper plating, comprising:
 contacting the copper plating solution that is used for the copper plating with at least a first electrode and a second electrode;   applying a voltage whose level varies over time between the first and second electrodes;   identifying the compound produced from the copper plating solution during the copper plating in a voltage range in which a variation in a current flowing between the first and second electrodes is observed; and   analyzing the concentration of the compound produced from the copper plating solution during the copper plating based on the maximum value of the current or the integral value of the current with respect to the voltage.   
     
     
         2 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 1 , further comprising:
 providing a third electrode that supplies at least a portion of the potential thereof to the first electrode or the second electrode at the same polarity or different polarities; and   contacting the copper plating solution with the third electrode.   
     
     
         3 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 1 ,
 wherein the voltage range is from +0.2 V to +2.0 V.   
     
     
         4 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 2 ,
 wherein the voltage range is from +0.2 V to +2.0 V.   
     
     
         5 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 1 ,
 wherein the concentration of the compound produced is analyzed based on a value obtained by subtracting the maximum value of the current or the integral value of the current with respect to the voltage, which is obtained from an initial make-up bath copper plating solution before being used, instead of the copper plating solution that is being used, from the maximum value of the current or the integral value of the current with respect to the voltage, which is obtained from the copper plating solution that is used for the copper plating.   
     
     
         6 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 2 ,
 wherein the concentration of the compound produced is analyzed based on a value obtained by subtracting the maximum value of the current or the integral value of the current with respect to the voltage, which is obtained from an initial make-up bath copper plating solution before being used, instead of the copper plating solution that is being used, from the maximum value of the current or the integral value of the current with respect to the voltage, which is obtained from the copper plating solution that is used for the copper plating.   
     
     
         7 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 5 ,
 wherein the temperature of the initial make-up bath copper plating solution and the temperature of the copper plating solution that is being used are measured,   the rate of change of the maximum value of the current or the integral value of the current with respect to the voltage of the initial make-up bath copper plating solution, which is separately analyzed, according to the temperature is used to convert the maximum value of the current or the integral value of the current with respect to the voltage of the analyzed initial make-up bath copper plating solution into a value corresponding to the temperature of the copper plating solution that is being used, and   the concentration of the compound produced is analyzed based on a value obtained by subtracting the converted value from the maximum value of the current or the integral value of the current with respect to the voltage of the copper plating solution used for copper plating.   
     
     
         8 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 6 ,
 wherein the temperature of the initial make-up bath copper plating solution and the temperature of the copper plating solution that is being used are measured,   the rate of change of the maximum value of the current or the integral value of the current with respect to the voltage of the initial make-up bath copper plating solution, which is separately analyzed, according to the temperature is used to convert the maximum value of the current or the integral value of the current with respect to the voltage of the analyzed initial make-up bath copper plating solution into a value corresponding to the temperature of the copper plating solution that is being used, and   the concentration of the compound produced is analyzed based on a value obtained by subtracting the converted value from the maximum value of the current or the integral value of the current with respect to the voltage of the copper plating solution used for copper plating.   
     
     
         9 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 5 ,
 wherein a copper plating solution obtained by making an analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble is used.   
     
     
         10 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 6 ,
 wherein a copper plating solution obtained by making an analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble is used.   
     
     
         11 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 5 ,
 wherein a copper plating solution obtained by making an analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble with a chemical species which forms a hardly soluble compound with the analysis preventing material is used.   
     
     
         12 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 6 ,
 wherein a copper plating solution obtained by making an analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble with a chemical species which forms a hardly soluble compound with the analysis preventing material is used.   
     
     
         13 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 5 ,
 wherein a copper plating solution obtained by making an analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble with cations which form a hardly soluble salt with the analysis preventing material is used.   
     
     
         14 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 6 ,
 wherein a copper plating solution obtained by making an analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble with cations which form a hardly soluble salt with the analysis preventing material is used.   
     
     
         15 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 9 ,
 wherein, after a pre-process selected from a precipitation process and/or a filtering process is performed to make the analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble, the analysis is performed.   
     
     
         16 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 11 ,
 wherein, after a pre-process selected from a precipitation process and/or a filtering process is performed to make the analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble, the analysis is performed.   
     
     
         17 . The method of analyzing a compound produced from a copper plating solution during copper plating according to  claim 13 ,
 wherein, after a pre-process selected from a precipitation process and/or a filtering process is performed to make the analysis preventing material, which is included in the initial make-up bath copper plating solution or the copper plating solution that is being used, hardly soluble, the analysis is performed.