Plate for heat exchanger, heat exchanger and air cooler comprising a heat exchanger

Abstract

A plate for a heat exchanger for heat exchange between a first and a second medium has a first side and an opposing second side. The first side is configured with at least one heat transferring elevation and with at least one heat transfer surface surrounding the elevation. Dimples are provided at either or both of the heat transferring elevation and the heat transfer surface to permit provision of a through-flow duct for the first medium. The second side is configured with at least one heat transferring depression corresponding to the elevation. The depression is configured to define a part of a through-flow duct for the second medium. The second side has at least one bonding surface corresponding to the heat transfer surface and surrounding the depression. A heat exchanger includes a stack of the above-mentioned plates and an air cooler includes such a heat exchanger.

1 . Plate for a heat exchanger for heat exchange between a first and a second medium,
 wherein the plate ( 1 ) has a first side (A) and an opposing second side (B),   wherein the first side (A) of said plate ( 1 ) is configured with at least one heat transferring elevation ( 2 ) and with at least one heat transfer surface ( 4 ) surrounding said elevation,   wherein dimples ( 5 ;  7 ) are provided at either or both of the heat transferring elevation ( 2 ) and the heat transfer surface ( 4 ) to permit provision of a through-flow duct (X) for the first medium,   wherein the second side (B) of said plate ( 1 ) is configured with at least one heat transferring depression ( 3 ) corresponding to said elevation ( 2 ), said depression being configured to define a part of a through-flow duct (Y) for the second medium, and with at least one bonding surface ( 6 ) corresponding to said heat transfer surface ( 4 ) and surrounding said depression,   wherein the heat transferring elevation ( 2 ) on the first side (A) of the plate ( 1 ) has a first height (h 1 ) corresponding to a depth of the heat transferring depression ( 3 ) on the second side (B) of the plate and a width (w) corresponding to a width of the heat transferring depression ( 3 ), and   wherein the heat transferring depression ( 3 ) on the second side (B) of the plate ( 1 ) is provided with pressure resisting dimples ( 8 ) with a height corresponding to said first height (h 1 ) of the heat transferring elevation ( 2 ) and to the depth of said corresponding heat transferring depression.   
     
     
         2 . Plate according to  claim 1 ,
 wherein the dimples ( 5 ) provided on the heat transfer surface ( 4 ) on the first side (A) of the plate ( 1 ) has a second height (h 2 ) which is larger than said first height (h 1 ), and/or   wherein the dimples ( 7 ) provided on the heat transferring elevation ( 2 ) on said first side (A) of the plate ( 1 ) has a height (h 2 -h 1 ) which together with the height (h 1 ) of the elevation is larger than said first height (h 1 ).   
     
     
         3 . Plate according to  claim 1 , wherein the width (w) of the heat transferring elevation ( 2 ) and of the corresponding heat transferring depression ( 3 ) is at least 5 times larger than said first height (h 1 ) of said heat transferring elevation and the depth of said corresponding heat transferring depression. 
     
     
         4 . Plate according to  claim 1 , wherein the heat transferring elevation ( 2 ) on the first side (A) of the plate ( 1 ) and the corresponding heat transferring depression ( 3 ) on the second side (B) of the plate are configured with two or more straight, parallel or substantially parallel portions. 
     
     
         5 . Plate according to  claim 1 , wherein the pressure resisting dimples ( 8 ) are elongated and arranged to extend obliquely across the heat transferring depression ( 3 ) and spaced apart from each other in the longitudinal direction of said heat transferring depression. 
     
     
         6 . Plate according to  claim 1 , wherein the heat transfer surface ( 4 ) on the first side (A) of the plate ( 1 ) is provided with reinforcing dimples ( 9 ). 
     
     
         7 . Plate according to  claim 2 , wherein the plate ( 1 ) is configured with first and second portholes ( 10  and  11 ) for the second medium, each of said portholes ( 10 ,  11 ) being on said first side (A) of the plate ( 1 ) configured with an edge ( 10   a ,  11   a ) which surrounds said porthole, said edge forming part of said heat transferring elevation ( 2 ) and having a height corresponding to said second height (h 2 ) of the dimples ( 5 ) and/or corresponding to the height (h 2 -h 1 ) of the dimples ( 7 ) provided on the heat transferring elevation ( 2 ) together with the height (h 1 ) of said heat transferring elevation. 
     
     
         8 . Heat exchanger for heat exchange between a first and a second medium,
 wherein said heat exchanger comprises a stack of plates ( 1 ) according to  claim 1 , and   wherein said plates ( 1 ) are arranged   such that the first side (A) of each plate is abutting the first side (A) of an adjacent plate ( 1 ) in the stack, thereby providing, by means of the dimples ( 5 ;  7 ) on either or both of the heat transfer surfaces ( 4 ) or the heat transferring elevations ( 2 ) on the first sides (A) of two adjacent plates in the stack, the through-flow duct (X) for the first medium between said first sides of said plates, and   such that the second side (B) of each plate ( 1 ) is abutting the second side (B) of an adjacent plate ( 1 ) in the stack, thereby defining, by means of the heat transferring depressions ( 3 ) on the second sides (B) of two adjacent plates in the stack, at least one through-flow duct (Y) for the second medium between said second sides of said plates.   
     
     
         9 . Heat exchanger according to claim B,
 wherein the first sides (A) of two adjacent plates ( 1 ) in the stack are assembled at opposing dimples ( 5 ;  7 ) on either or both of the heat transfer surfaces ( 4 ) and the heat transferring elevations ( 2 ) on said first sides, and assembled at opposing edges ( 10   a ,  11   a ) on said first sides surrounding portholes ( 10 ,  11 ) for the second medium in the plates by leak-free bonding of said edges to each other.   
     
     
         10 . Heat exchanger according to  claim 8 ,
 wherein the pressure resisting dimples ( 8 ) in the heat transferring depressions ( 3 ) on the second sides (B) of two adjacent plates ( 1 ) in the stack are configured for engagement with each other when said second sides (B) of said two adjacent plates ( 1 ) in the stack abut each other.   
     
     
         11 . Heat exchanger according to  claim 10 ,
 wherein the second sides (B) of two adjacent plates ( 1 ) in the stack are assembled by leak-free bonding of opposing bonding surfaces ( 6 ) on said second sides to each other and assembled at opposing dimples ( 8 ) in the heat transferring depressions ( 3 ) on said second sides.   
     
     
         12 . Heat exchanger according to  claim 8 ,
 wherein straight, parallel or substantially parallel portions of the heat transferring depressions ( 3 ) on the second sides (B) of two adjacent plates ( 1 ) defining the through-flow duct (Y) for the second medium extend in a first direction (D 1 ) of the plate, and   wherein the through-flow duct (X) for the first medium provided between the first sides (A) of two adjacent plates ( 1 ) extends in a second direction (D 2 ) of the plate which is substantially perpendicular to said first direction (D 1 ).   
     
     
         13 . Heat exchanger according to  claim 8 , wherein the stack of plates ( 1 ) of the heat exchanger is located in a frame work ( 12 ) with opposing plate elements ( 13  and  14 ). 
     
     
         14 . Heat exchanger according to  claim 13 , wherein at least one of the opposing plate elements ( 13 ,  14 ) is provided with pipe connections ( 15  and  16 ) for the second medium. 
     
     
         15 . Air cooler comprising a heat exchanger according to  claim 8 , wherein the first medium is air and the second medium is a liquid.