Conductive substrate comprising conductive pattern and touch panel comprising same

Abstract

The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern.

1 . A conductive substrate comprising:
 a transparent substrate, and   a conductive pattern comprising a conductive line provided on the transparent substrate,   wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less.   
     
     
         2 . The conductive substrate of  claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 10 μm or less. 
     
     
         3 . The conductive substrate of  claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 5 μm or less. 
     
     
         4 . The conductive substrate of  claim 1 , comprising:
 a line breakage portion performing breakage at an angle of 80 to 110° in the longitudinal direction of at least one conductive line constituting the conductive pattern.   
     
     
         5 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises one or more selected from the group consisting of metal, metal oxides, metal nitrides, metal oxynitrides, and a metal alloy. 
     
     
         6 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises one or more selected from the group consisting of Ag, Cu, Cr, Al, Mo, Ni, oxides thereof, nitrides thereof, oxynitride thereof, and an alloy thereof. 
     
     
         7 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises a regular pattern. 
     
     
         8 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises an irregular pattern. 
     
     
         9 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises an edge structure of continuously connected closed figures, the closed figures having the same shape are not present in a predetermined unit area (1 cm×1 cm) in the conductive pattern, and the number of vertexes of the closed figures is different from the number of vertexes of quadrangles having the same number as the closed figures. 
     
     
         10 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises the edge structure of continuously connected closed figures, the closed figures having the same shape are not present in the predetermined unit area (1 cm×1 cm) in the conductive pattern, and the number of vertexes of the closed figures is different from the number of vertexes of a polygon formed by connecting shortest distances between centers of gravity of the closed figures. 
     
     
         11 . The conductive substrate of  claim 1 , wherein the conductive pattern comprises an edge structure of continuously connected closed figures, the closed figures having the same shape are not present in the predetermined unit area (1 cm×1 cm) in the conductive pattern, and a value of the following Equation 1 is 50 or more in the closed figures:
   (Standard deviation of distances between the vertexes/Average of the distances between the vertexes)×100   [Equation 1]
 
 
     
     
         12 . A conductive substrate comprising:
 a transparent substrate, and   a conductive pattern comprising a conductive line provided on the transparent substrate,   wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and the conductive pattern further comprises a conductive line provided in spaced regions to be electrically isolated,   the conductive lines provided in the spaced regions to be electrically isolated have an area of 80% to 120% to a product of a length of the spaced region and a line width of the conductive line, and   a distance between ends of the conductive lines provided in the spaced regions to be electrically isolated and ends of the conductive lines spaced from each other, which are adjacent thereto, is 15 μm or less.   
     
     
         13 . The conductive substrate of  claim 12 , wherein the distance between the ends of the conductive lines provided in the spaced regions to be electrically isolated and the ends of the conductive lines spaced from each other, which are adjacent thereto, is 10 μm or less. 
     
     
         14 . The conductive substrate of  claim 12 , wherein the distance between the ends of the conductive lines provided in the spaced regions to be electrically isolated and the ends of the conductive lines spaced from each other, which are adjacent thereto, is 5 μm or less. 
     
     
         15 . A method of manufacturing the conductive substrate of  claim 1 , comprising:
 forming a conductive pattern provided on a transparent substrate so that the conductive pattern comprises a line breakage portion performing breakage at an angle of 80 to 110° in a longitudinal direction of at least one conductive line constituting the conductive pattern.   
     
     
         16 . The method of manufacturing the conductive substrate of  claim 15 , wherein the forming of the conductive pattern provided on the transparent substrate is performed by a printing process. 
     
     
         17 . The method of manufacturing the conductive substrate of  claim 15 , wherein the printing process is a reverse offset printing process. 
     
     
         18 . A touch panel comprising:
 the conductive substrate according to  claim 1 .   
     
     
         19 . The touch panel of  claim 18 , wherein a haze value of the touch panel is 10% or less and transmittance is 75% or more. 
     
     
         20 . The touch panel of  claim 18 , wherein the haze value of the touch panel is 5% or less and the transmittance is 85% or more. 
     
     
         21 . The touch panel of  claim 18 , wherein the haze value of the touch panel is 2% or less and the transmittance is 90% or more.