Cooling device, and electronic apparatus with the cooling device

Abstract

According to one embodiment, a cooling device is provided with a heat receiving member connected to a heat generator, a heat pipe connected to the heat receiving member, a heat dissipation fin connected to the heat pipe at an opposite side of the heat receiving member, and a fan configured to cool the heat dissipation fin. The cooling device is also provided with a tank containing a liquid and thermally connected to the heat receiving member.

What is claimed is: 
     
         1 . A cooling device comprising:
 a heat receiving member connected to a heat generator;   a heat pipe connected to the heat receiving member;   a heat dissipation fin connected to the heat pipe at an opposite side of the heat receiving member;   a fan configured to cool the heat dissipation fin; and   a tank containing a liquid and thermally connected to the heat receiving member.   
     
     
         2 . The cooling device of  claim 1 , wherein when an end of the heat pipe connected to the heat receiving member is positioned gravitationally above another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank overlaps with the heat receiving member. 
     
     
         3 . The cooling device of  claim 2 , wherein when the end of the heat pipe connected to the heat receiving member is positioned gravitationally below the another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank does not overlap with the heat receiving member. 
     
     
         4 . The cooling device of  claim 1 , wherein the tank is located closer to a suction port of the fan than the heat pipe. 
     
     
         5 . The cooling device of  claim 1 , wherein
 the heat pipe is angled in an L shape; and   the tank is attached to the heat receiving member in a positional relationship in which the liquid in the tank does not overlap with the heat receiving member when a first portion of the heat pipe between the end of the heat pipe and an angled portion of the heat pipe extends vertically and the another end of the heat pipe connected to the fin is positioned gravitationally above the end of the heat pipe, and when a second portion between the angled portion of the heat pipe and the another end of the heat pipe extends vertically and the another end of the heat pipe is positioned gravitationally above the end of the heat pipe.   
     
     
         6 . The cooling device of  claim 1 , wherein the tank is attached to the heat receiving member by solder. 
     
     
         7 . An electronic apparatus comprising:
 a housing with an exhaust port;   a heat generator in the housing; and   a cooling device attached to the heat generator,   wherein   the cooling device comprises:   a heat receiving member connected to the heat generator;   a heat pipe connected to the heat receiving member;   a heat dissipation fin connected to the heat pipe at an opposite side of the heat receiving member, and opposing an inside of the exhaust port;   a fan located near the exhaust port with the heat dissipation fin interposed therebetween, and configured to cool the heat dissipation fin; and   a tank containing a liquid and thermally connected to the heat receiving member.   
     
     
         8 . The electronic apparatus of  claim 7 , wherein when the housing assumes an attitude in which an end of the heat pipe connected to the heat receiving member is positioned gravitationally above another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank overlaps with the heat receiving member. 
     
     
         9 . The electronic apparatus of  claim 7 , wherein when the housing assumes an attitude in which the end of the heat pipe connected to the heat receiving member is positioned gravitationally below the another end of the heat pipe connected to the heat dissipation fin, the liquid in the tank does not overlap with the heat receiving member. 
     
     
         10 . The electronic apparatus of  claim 7 , wherein the tank is located closer to a suction port of the fan than the heat pipe. 
     
     
         11 . The electronic apparatus of  claim 7 , wherein
 the heat pipe is angled in an L shape; and   the tank is attached to the heat receiving member in a positional relationship in which the liquid in the tank does not overlap with the heat receiving member when a first portion of the heat pipe between the end of the heat pipe and an angled portion of the heat pipe extends vertically and the another end of the heat pipe connected to the fin is positioned gravitationally above the end of the heat pipe, and when a second portion between the angled portion of the heat pipe and the another end of the heat pipe extends vertically and the another end of the heat pipe is positioned gravitationally above the end of the heat pipe.   
     
     
         12 . The electronic apparatus of  claim 7 , wherein the tank is attached to the heat receiving member by solder.