US2014150255A1PendingUtilityA1
Electronic Assembly
Est. expiryFeb 10, 2031(~4.5 yrs left)· nominal 20-yr term from priority
H05K 1/182H05K 2201/09645H05K 13/04H05K 3/30H05K 2201/10583H05K 2201/09063Y10T29/4913
39
PatentIndex Score
0
Cited by
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References
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Claims
Abstract
An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of mounting an electronic device onto a substrate so as to form part of an electronic assembly, said method comprising the steps of:
obtaining an electronic component having a disk-shaped, annular lead; providing a cylindrical open space in the substrate, said open space being accessible through a circular opening in an outermost surface of said substrate, said open space having a diameter smaller than the diameter of said disk-shaped annular lead; and, installing said electronic component into said cylindrical open space such that said circular opening is closed by said disk-shaped, annular lead.
2 . The method of claim 1 wherein said step of installing comprises the step of establishing electrical contact between a second lead on said electronic component and a connection pad on said substrate.
3 . The method of claim 1 wherein said cylindrical open space extends through said substrate.Join the waitlist — get patent alerts
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