US2014150255A1PendingUtilityA1

Electronic Assembly

Assignee: GREEN RODNEY AUSTINPriority: Feb 10, 2011Filed: Feb 10, 2014Published: Jun 5, 2014
Est. expiryFeb 10, 2031(~4.5 yrs left)· nominal 20-yr term from priority
H05K 1/182H05K 2201/09645H05K 13/04H05K 3/30H05K 2201/10583H05K 2201/09063Y10T29/4913
39
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Claims

Abstract

An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of mounting an electronic device onto a substrate so as to form part of an electronic assembly, said method comprising the steps of:
 obtaining an electronic component having a disk-shaped, annular lead;   providing a cylindrical open space in the substrate, said open space being accessible through a circular opening in an outermost surface of said substrate, said open space having a diameter smaller than the diameter of said disk-shaped annular lead; and,   installing said electronic component into said cylindrical open space such that said circular opening is closed by said disk-shaped, annular lead.   
     
     
         2 . The method of  claim 1  wherein said step of installing comprises the step of establishing electrical contact between a second lead on said electronic component and a connection pad on said substrate. 
     
     
         3 . The method of  claim 1  wherein said cylindrical open space extends through said substrate.

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