US2014139971A1PendingUtilityA1

Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials

Assignee: KEMET ELECTRONICS CORPPriority: Jul 8, 2011Filed: Jan 28, 2014Published: May 22, 2014
Est. expiryJul 8, 2031(~5 yrs left)· nominal 20-yr term from priority
H01G 4/30H01G 13/02H01G 4/1227Y10T29/43H01G 13/06B05D 3/06
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Claims

Abstract

An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.

Claims

exact text as granted — not AI-modified
1 - 20 . (canceled) 
     
     
         21 . A method for forming a capacitor comprising:
 providing a multilayered ceramic capacitor stack comprising parallel electrodes of alternating polarity with dielectric between adjacent electrodes wherein electrodes of common polarity are exposed;   applying an electrode paste to said multilayered ceramic capacitor stack wherein said electrode paste is in electrical contact with said electrodes of common polarity;   sintering said electrode paste to form an external termination;   printing a metal paste in a predetermined pattern on said multilayered ceramic capacitor stack; and   sintering said metal paste;   wherein at least one of said sintering said electrode paste or said sintering said metal paste comprises sintering with a high intensity high pulse frequency light.   
     
     
         22 . The method for forming a capacitor of  claim 21  wherein said metal paste comprises a material selected from the group consisting of ruthenium, silver, palladium, platinum, copper and gold. 
     
     
         23 . The method for forming a capacitor of  claim 21  wherein said sintered metal paste comprises ruthenium dioxide, tantalum nitride or nickel chromium. 
     
     
         24 . The method for forming a capacitor of  claim 21  wherein said internal electrodes comprise a material selected from a base metal and a precious metal. 
     
     
         25 . The method for forming a capacitor of  claim 24  wherein said base metal is nickel. 
     
     
         26 . A capacitor with a bleed resistor integral thereto comprising:
 a capacitor comprising:   first base metal internal electrodes terminating at a first external termination and second based metal internal electrodes terminating at a second external termination with ceramic between said first base metal internal electrodes and said second external electrodes; and   a resistive trace on said capacitor wherein said resistive trace is electrically connected to said first external termination and said second external termination wherein said resistive trace comprises ruthenium dioxide, tantalum nitride or nickel chromium.

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