Led light source, its manufacturing method, and led-based photolithography apparatus and method

Abstract

Structurally-simple LED light source preventing temperature variations among multiple LED elements arranged densely on LED-mounting substrate is described. LED light source includes a plurality of LED elements each of which is formed by connecting an LED chip to electrodes formed on a ceramic substrate; LED-mounting substrate on which to mount the plurality of LED elements, the LED-mounting substrate having through holes therein; and heat sink plate for releasing heat from the LED-mounting substrate, wherein a thermally conductive resin is present between the LED-mounting substrate and the heat sink plate and wherein part of the thermally conductive resin protrudes from the through holes of the LED-mounting substrate and covers the top surface of the LED-mounting substrate on which the plurality of LED elements are mounted, so thermally conductive resin is in contact with the plurality of LED elements.

What is claimed is: 
     
         1 . A method for manufacturing an LED light source, the method comprising the steps of:
 applying a thermally conductive resin on a heat sink plate;   pressing a bottom surface of an LED-mounting substrate, on a top surface of which a plurality of LED elements are mounted and through holes are formed on the LED-mounting substrate, against the heat sink plate on which the thermally conductive resin has been applied until the distance between the heat sink plate and the LED-mounting substrate becomes a particular value, so that the thermally conductive resin can spread between the heat sink plate and the LED-mounting substrate and so that part of the thermally conductive resin flows the through holes from the bottom surface to the top surface of the LED-mounting substrate and spread out on the top surface of the LED-mounting substrate so as to fill spaces between the plurality of LED elements; and   heating the thermally conductive resin for solidification after the pressing step.   
     
     
         2 . The method of  claim 1 , wherein the plurality of LED elements are each formed by wiring an LED chip to electrodes formed on a ceramic substrate. 
     
     
         3 . The method of  claim 1 , wherein the thermally conductive resin is higher in thermal conductivity than the LED-mounting substrate.