Method of manufacturing light emitting device package

Abstract

A method of manufacturing a light emitting device package, includes following steps: providing a base which having a first surface and an opposite second surface, and electrical structures formed on the first surface, defining two through holes through the first and second surfaces; mounting a light emitting element on the first surface, the light emitting element having one pad on a top surface thereof; forming a mask on the first surface, the mask covering the light emitting element and defining at least one opening for exposing the at least one pad; electrically connecting the at least one pad to the electrical structures via at least one metal wire; filling liquid encapsulating material in a space between the mask and the first surface to form an encapsulating layer that encapsulating the light emitting element, the encapsulating layer being separated from the at least one metal wire and comprising phosphors therein.

What is claimed is: 
     
         1 . A method of manufacturing a light emitting device package, comprising the following steps:
 A) providing a base, the base having a first surface and an opposite second surface, the base defining at least two through holes extending through the first and second surfaces, and the base having electrical structures formed on the first surface;   B) mounting a light emitting element on the first surface of the base, the light emitting element having at least one pad on a top surface thereof;   C) forming a mask on the first surface, the mask covering the light emitting element and defining at least one opening for exposing the at least one pad;   D) electrically connecting the at least one pad to the electrical structures via at least one metal wire;   E) filling liquid encapsulating material in a space between the mask and the first surface to form an encapsulating layer that encapsulating the light emitting element, the encapsulating layer being separated from the at least one metal wire and comprising phosphors therein; and   F) forming a cover layer on the first surface to cover and protect the mask and the at least one metal wire.   
     
     
         2 . The method of  claim 1 , further comprising a step of forming a sealing layer on the mask for sealing the at least one opening and covering a joint of the at least one pad and the at least one metal wire, after the step D and before the step E. 
     
     
         3 . The method of  claim 1 , further comprising a step of forming another sealing layer on the second surface for covering the at least two through holes. 
     
     
         4 . The method of  claim 1 , further comprising a step of filling heat conductive material in the at least two through holes. 
     
     
         5 . The method of  claim 1 , wherein the cover layer is separated from the mask and the at least one metal wire.