Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) For Lighting Solutions And Method Of Manufacturing Thereof

Abstract

The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.

We claim: 
     
         1 . A Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) package for a lighting solution comprising:
 a dual lead frame assembly comprising:
 a bottom lead frame having a centre, raised plateau, which defines a first heat sink pad, so that the raised plateau is connected to the surrounding lead frame material along two opposed edges of the plateau; and 
 a top lead frame having a second heat sink pad, an anode and a cathode, with the anode and cathode being disposed on opposed sides of the second heat sink pad; and 
   a microelectronic lighting device mounted on the second heat sink pad and electrically connected to the anode and cathode; wherein solder or glue disposed on the first and second heat sink pads thermally connect the microelectronic lighting device to the bottom lead frame for heat dissipation.   
     
     
         2 . A SHDMIP package according to  claim 1 , wherein the dual lead frame assembly comprises a plurality of dual lead frame assemblies, with the bottom lead frames being connected to adjacent lead frames by tie bars and the top lead frames being similarly connected to adjacent lead frames by separate tie bars. 
     
     
         3 . A SHDMIP package according to  claim 2 , further comprising a protection and driver circuit disposed on each of the second heat sink pad, with each of the protection and driver circuit being electrically connected to the associated microelectronic lighting device, anode and cathode. 
     
     
         4 . A SHDMIP package according to  claim 3 , further comprising a lens formed to encapsulate each microelectronic lighting device, protection/driver circuit and associated electrical connections onto the top lead frame. 
     
     
         5 . A SHDMIP package according to  claim 4 , wherein the ties bars are trimmed to produce individual lighting devices or the tie bars are selectively trimmed to produce an array of lighting devices connected in series, parallel or combination of series and parallel. 
     
     
         6 . A SHDMIP package according to  claim 2 , wherein each dual lead frame assembly is disposed in a cavity mold for encapsulation but with the second heat sink pads, anodes and cathodes being exposed. 
     
     
         7 . A SHDMIP package according to  claim 6 , further comprising a protection and driver circuit disposed on each of the second heat sink pad, with each of the protection and driver circuit being electrically connected to the associated microelectronic lighting device, anode and cathode; and a lens is formed to encapsulate each microelectronic lighting device, protection/driver circuit and associated electrical connections onto the top lead frame. 
     
     
         8 . A SHDMIP package according to  claim 7 , wherein the ties bars are trimmed to produce individual lighting devices or the tie bars are selectively trimmed to produce an array of lighting devices connected in series, parallel or combination of series and parallel. 
     
     
         9 . A SHDMIP package according to  claim 2 , wherein the tie bars are selectively trimmed to produce an array of the dual lead frame assemblies connected in series, parallel or combination of series and parallel, and the array of assemblies is encapsulated to produce a panel molding but with the second heat sink pads, anodes and cathodes being exposed. 
     
     
         10 . A SHDMIP package according to  claim 9 , further comprising a protection and driver circuit disposed on each of the second heat sink pad, with each of the protection and driver circuit being electrically connected to the associated microelectronic lighting device, anode and cathode; and a lens is formed to encapsulate each microelectronic lighting device, protection/driver circuit and associated electrical connections onto the top lead frame. 
     
     
         11 . A Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) package for a lighting solution comprising:
 a dual lead frame assembly comprising:
 a bottom lead frame formed with two T-shaped electrodes arranged as mirror images and in a north-south manner, and two first heat sinks arranged in the east-west manner, with one heat sink on each side of the T-shaped electrodes; and 
 a top lead frame having a middle, raised plateau, which defines a second heat sink pad, and an anode and cathode, with the anode and cathode being disposed on opposed sides of the second heat sink in a north-south manner; and 
   a microelectronic lighting device mounted on the second heat sink pad and electrically connected to the anode and cathode; wherein solder on the T-shaped electrodes electrically connect the T-shaped electrode to the anode or cathode and solder or glue on first heat sinks thermally connect the microelectronic lighting device to the bottom lead frame for heat dissipation.   
     
     
         12 . A SHDMIP package according to  claim 11 , wherein the dual lead frame assembly comprises a plurality of dual lead frame assemblies, with the bottom lead frames being connected to adjacent lead frames by tie bars and the top lead frames being similarly connected to adjacent lead frames by separate tie bars. 
     
     
         13 . A SHDMIP package according to  claim 12 , further comprising a protection and driver circuit disposed to bridge two limbs of the T-shaped electrodes in the north-south manner in each lead frame assembly, thereby the protection and driver circuit is electrically connected to the associated microelectronic lighting device, anode and cathode. 
     
     
         14 . A SHDMIP package according to  claim 13 , wherein each dual lead frame assembly is disposed in a cavity mold for encapsulation but with the second heat sink pads, anodes and cathodes being exposed. 
     
     
         15 . A SHDMIP package according to  claim 14 , further comprising a lens formed to encapsulate each microelectronic lighting device onto the associated top lead frame. 
     
     
         16 . A SHDMIP package according to  claim 15 , wherein the ties bars are trimmed to produce individual lighting devices or the tie bars are selectively trimmed to produce an array of lighting devices connected in series, parallel or combination of series and parallel. 
     
     
         17 . A SHDMIP package according to  claim 13 , wherein the tie bars are selectively trimmed to produce an array of the dual lead frame assemblies connected in series, parallel or combination of series and parallel, and the array of assemblies is encapsulated to produce a panel molding but with the second heat sink pads, anodes and cathodes being exposed. 
     
     
         18 . A SHDMIP package according to  claim 17 , further comprising a lens formed to encapsulate each microelectronic lighting device. 
     
     
         19 . A SHDMIP package according to  claim 1 , wherein the dual lead frame assembly is made from an electrically conductive material selected from the following: metal, metal alloy or ceramic. 
     
     
         20 . A SHDMIP package of according to  claim 11 , wherein the dual lead frame assembly is made from an electrically conductive material selected from the following: metal, metal alloy or ceramic.