Apparatus for non-chemical, non-optical edge bead removal

Abstract

A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also, an apparatus to perform the inventive method.

1 . An apparatus for semiconductor manufacturing, comprising:
 a substrate support configured to hold a substrate comprising an edge bead material proximate an outer edge of the substrate;   a mechanism configured to rotate the substrate support;   a source of an edge bead removing medium, the edge bead removing medium comprising a non-solvent, non-aerosol gas and lacking solid particles; and   a device configured to deliver a high pressure stream of the edge bead removing medium to a periphery of a substrate mounted on the substrate support.   
     
     
         2 . The apparatus of  claim 1 , wherein the device configured to deliver the high pressure stream of the edge bead removing medium comprises an air knife or nozzle. 
     
     
         3 . (canceled) 
     
     
         4 . (canceled) 
     
     
         5 . The apparatus of  claim 1 , wherein the device configured to deliver the high pressure stream of the edge bead removing medium contains the edge bead removing medium. 
     
     
         6 . The apparatus of  claim 1 , wherein the device configured to deliver the high pressure stream of the edge bead removing medium contains the non-solvent, non-aerosol gas without a liquid solvent and without the solid particles. 
     
     
         7 . (canceled) 
     
     
         8 . The apparatus of  claim 7 , wherein the substrate is comprises a semiconductor wafer. 
     
     
         9 . (canceled) 
     
     
         10 . The apparatus of  claim 1 , further comprising a source of cleaning solution. 
     
     
         11 . The apparatus of  claim 10 , further comprising a device configured to deliver the cleaning solution onto at least one of a periphery and an underside of the substrate. 
     
     
         12 . An apparatus for semiconductor manufacturing, comprising:
 a substrate support configured to hold a substrate;   a mechanism configured to rotate the substrate support;   a device configured to apply a coating material onto a substrate situated on the substrate support;   a source of a non-dissolving medium of the coating material, the non-dissolving medium comprising a non-solvent, non-aerosol gas and lacking solid particles; and   a device configured to deliver a high pressure stream of the non-dissolving medium onto a periphery of the substrate situated on the substrate support.   
     
     
         13 . The apparatus of  claim 12 , further comprising:
 a source of cleaning solution; and   a device configured to deliver the cleaning solution onto at least one of a periphery and an underside of the substrate situated on the substrate support.   
     
     
         14 . The apparatus of  claim 13 , wherein the source of cleaning solution comprises a source of water. 
     
     
         15 . The apparatus of  claim 12 , wherein the source of the non-dissolving medium comprises a source of a gas selected from the group consisting of air, a noble gas, and nitrogen gas. 
     
     
         16 . The apparatus of  claim 12 , wherein the device configured to apply the coating material onto the substrate comprises a device configured to apply a photoresist material onto the substrate. 
     
     
         17 . An apparatus for semiconductor manufacturing, comprising:
 a substrate support configured to hold a substrate comprising an edge bead material proximate an outer edge of the substrate;   a mechanism configured to rotate the substrate support;   a source of a non-solvent, non-aerosol gas lacking solid particles;   a device configured to deliver the non-solvent, non-aerosol gas lacking solid particles onto a periphery of a substrate mounted on the substrate support;   a source of cleaning solution; and   a device configured to deliver the cleaning solution onto at least one of the periphery and an underside of the substrate mounted on the substrate support.