US2014124482A1PendingUtilityA1
Modified flux system in cored electrode
Est. expiryApr 5, 2025(expired)· nominal 20-yr term from priority
Inventors:Rajeev Katiyar
B23K 35/3608B23K 35/362B23K 35/3607B23K 35/368B23K 35/00B23K 9/173
50
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Claims
Abstract
A cored electrode having reduced moisture pick-up properties and which forms a weld bead with low diffusible hydrogen in a gas shielded electric arc welding process. The cored electrode includes a metal sheath and a fill composition. The fill composition includes titanium dioxide, slag forming agent and a sodium-silica-titanate compound.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of forming a weld bead having a low diffusible hydrogen content by use of an electrode having reduced moisture pick-up comprising:
providing a cored electrode that includes a metal sheath and a fill composition, said fill composition including titanium dioxide, a slag forming agent and a moisture resistant compound, said moisture resistant compound comprising a sodium-silico-titanate compound, wherein said sodium-silico-titanate compound is formed of a combination of a titanium compound, a potassium compound, a sodium compound and colloidal silica, said moisture resistant compound having an average particle size of 30-250 mesh, said moisture resistant compound including over 50 weight percent titanium compound, said moisture resistant compound having a weight ratio of sedum compound to potassium compound of about 1.1-5:1, said moisture resistant compound including at least about 1 weight percent colloidal silica, said colloidal silica having an average particle size of less than about 40 nm; and, at least partially melting said cored electrode by an electric current to cause said melted portion of said cored electrode to be deposited on a workpiece.
2 . The method as defined in claim 1 , including the step of
directing a shielding gas to said workpiece to at least partially shield said melted portion of said cored electrode being deposited on a workpiece.
3 . The method as defined in claim 2 , wherein
said shielding gas includes argon, carbon dioxide or mixtures thereof.
4 . The method as defined in claim 1 , wherein
said titanium dioxide minus any titanium dioxide in said moisture resistant compound is about 2-40 weight percent of said fill composition.
5 . The method as defined in claim 2 , wherein
said titanium dioxide minus any titanium dioxide in said moisture resistant compound is about 2-40 weight percent of said fill composition.
6 . The method as defined in claim 1 , wherein
said slag forming agent constitutes about 10-50 weight percent of said fill composition.
7 . The method as defined in claim 5 , wherein
said slag forming agent constitutes about 10-50 weight percent of said fill composition.
8 . The method as defined in claim 1 , wherein
said slag forming agent includes a metal oxide.
9 . The method as defined in claim 7 , wherein
a majority of said slag forming agent includes said metal oxide.
10 . The method as defined in claim 1 , wherein
said moisture resistant compound constitutes about 1-40 weight percent of said fill composition.
11 . The method as defined in claim 9 , wherein
said moisture resistant compound constitutes about 1-40 weight percent of said fill composition.
12 . The method as defined in claim 1 , including
a metal alloying agent, said metal alloying agent including aluminum, magnesium, silicon, titanium, and mixtures thereof.
13 . The method as defined in claim 1 , wherein said fill composition includes:
TiO 2
2-50%
Sodium-silico-titanate compound
1-55%
Slag forming Agent
1-60%
Metal Alloying Agent
0-70%
14 . The method as defined in claim 1 , wherein said fill composition includes:
TiO 2
3-40%
Sodium-silico-titanate compound
1-55%
Slag forming Agent
20-50%
Metal Alloying Agent
0-55%
15 . The method as defined in claim 1 , wherein said moisture resistant compound includes by weight percent:
TiO 2
60-90%
Sodium silicate
1-20%
Potassium silicate
1-15%
Sodium compound
1-20%
Colloidal Silica
1-10%
Other components
0-5%
16 . The method as defined in claim 15 wherein
said moisture resistant compound having reduced moisture pick-up such that the moisture pick-up of said moisture resistant compound over a 96 hour period at 80° F. and 80% relative humidity is less than about 0.2% for particles having an average particle size of 40-200 mesh.
17 . The method as defined in claim 15 wherein said moisture resistant compound includes by weight percent:
TiO 2
70-90%
Sodium silicate
4-15%
Potassium silicate
1-10%
Sodium carbonate
3-16%
Colloidal Silica
2-6%
Other components
0-1%
18 . The method as defined in claim 17 wherein said moisture resistant compound includes by weight percent:
TiO 2
70-80%
Sodium silicate
3.5-10%
Potassium silicate
1.5-6%
Sodium carbonate
5-15%
Colloidal Silica
2-5%
Other components
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