Cmp pad conditioners with mosaic abrasive segments and associated methods

Abstract

A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

What is claimed is: 
     
         1 . A CMP pad conditioner, comprising:
 a plurality of abrasive segments, each abrasive segment including:
 a segment blank; and 
 an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material; and 
   a pad conditioner substrate;   each of the plurality of abrasive segments being permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.   
     
     
         2 . The pad conditioner of  claim 1 , wherein at least some of the plurality of abrasive segments are radially distributed about a face of the pad conditioner substrate. 
     
     
         3 . The pad conditioner of  claim 1 , wherein at least two of the plurality of abrasive segments differ in at least one of: a geometric configuration; an abrasive layer material; and an abrasive profile. 
     
     
         4 . The pad conditioner of  claim 1 , wherein arrangement of the abrasive segments on the face of the pad conditioner substrate uniformly distributes drag forces across substantially each abrasive segment. 
     
     
         5 . The pad conditioner of  claim 1 , wherein a longitudinal axis of each of the plurality of abrasive segments is aligned along a radius of the pad conditioner substrate. 
     
     
         6 . The pad conditioner of  claim 1 , wherein each of the abrasive layers includes an abrading surface or point, and wherein the abrading surfaces or points are leveled relative to one another such that no abrading surface or point protrudes above another abrading surface or point by more than about 30 microns. 
     
     
         7 . The pad conditioner of  claim 1 , wherein each of the abrasive layers includes an abrading surface or point, and wherein at least one abrading surface or point is oriented at a greater elevation than is an abrading surface or point of an immediately adjacent abrasive layer. 
     
     
         8 . The pad conditioner of  claim 1 , wherein the plurality of abrasive layers are attached to the segment blanks with an organic material layer including one or more of: amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and mixtures thereof. 
     
     
         9 . The pad conditioner of  claim 1 , wherein the abrasive layers are attached to the segments blanks by a brazing alloy. 
     
     
         10 . The pad conditioner of  claim 1 , wherein the abrasive layers comprise PCD blades. 
     
     
         11 . The pad conditioner of  claim 1 , wherein the abrasive layers include individual abrasive grits. 
     
     
         12 . The pad conditioner of  claim 1 , wherein each of the abrasive layers includes a cutting face, and wherein each cutting face is angled at 90 degrees or less relative to a finished surface of the CMP pad. 
     
     
         13 . A CMP pad conditioner, comprising:
 a plurality of abrasive segments, each abrasive segment including:
 a segment blank; and 
 an abrasive layer attached to the segment blank by a brazing alloy, the abrasive layer including a superhard abrasive material; and 
   a pad conditioner substrate;   each of the plurality of abrasive segments being permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.   
     
     
         14 . The pad conditioner of  claim 13 , wherein at least some of the plurality of abrasive segments are radially distributed about a face of the pad conditioner substrate. 
     
     
         15 . The pad conditioner of  claim 13 , wherein at least two of the plurality of abrasive segments differ in at least one of: a geometric configuration; an abrasive layer material; and an abrasive profile. 
     
     
         16 . The pad conditioner of  claim 13 , wherein arrangement of the abrasive segments on the face of the pad conditioner substrate uniformly distributes drag forces across substantially each abrasive segment. 
     
     
         17 . The pad conditioner of  claim 13 , wherein a longitudinal axis of each of the plurality of abrasive segments is aligned along a radius of the pad conditioner substrate. 
     
     
         18 . The pad conditioner of  claim 13 , wherein each of the abrasive layers includes an abrading surface or point, and wherein the abrading surfaces or points are leveled relative to one another such that no abrading surface or point protrudes above another abrading surface or point by more than about 30 microns. 
     
     
         19 . The pad conditioner of  claim 13 , wherein each of the abrasive layers includes an abrading surface or point, and wherein at least one abrading surface or point is oriented at a greater elevation than is an abrading surface or point of an immediately adjacent abrasive layer. 
     
     
         20 . A method of conditioning a CMP pad comprising:
 providing a pad conditioner as recited in  claim 1 ; and   actuating the conditioner against the pad in a manner sufficient to remove debris therefrom.