Coated fibrous copper microparticles, and electrically conductive coating agent and electrically conductive film each containing said coated fibrous copper microparticles

Abstract

The present invention provides coated fibrous copper microparticles, wherein the coated fibrous copper microparticles are fibrous copper microparticles each at least partially coated with a metal other than copper, and the length and the aspect ratio of the fibrous copper microparticles are 1 μm or more and 10 or more, respectively.

1 . Coated fibrous copper microparticles, wherein the coated fibrous copper microparticles are fibrous copper microparticles each at least partially coated with a metal other than copper, and a length and an aspect ratio of the fibrous copper microparticles are 1 μm or more and 10 or more, respectively. 
     
     
         2 . The coated fibrous copper microparticles according to  claim 1 , wherein a minor axis of the fibrous copper microparticles is 1 μm or less, and a proportion, in the fibrous copper microparticles, of copper particles having a minor axis of 0.3 μm or more and an aspect ratio of 1.5 or less is 0.1 or less per one fibrous copper microparticle. 
     
     
         3 . An electrically conductive coating agent comprising the coated fibrous copper microparticles according to  claim 1 . 
     
     
         4 . An electrically conductive layer comprising the coated fibrous copper microparticles according to  claim 1 . 
     
     
         5 . An electrically conductive film comprising a substrate, and the electrically conductive layer according to  claim 4 , formed on the substrate. 
     
     
         6 . An electrically conductive coating agent comprising the coated fibrous copper microparticles according to  claim 2 . 
     
     
         7 . An electrically conductive layer comprising the coated fibrous copper microparticles according to  claim 2 . 
     
     
         8 . An electrically conductive film comprising a substrate, and the electrically conductive layer according to  claim 7 , formed on the substrate.