US2014120199A1PendingUtilityA1
Mold, imprint method, and process for producing chip
Est. expirySep 6, 2025(expired)· nominal 20-yr term from priority
B82Y 10/00B29C 59/022G03F 9/7042G03F 7/2012B82Y 40/00G03F 7/0017G03F 7/0002B29C 59/00
63
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Claims
Abstract
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
Claims
exact text as granted — not AI-modified1 . A mold comprising:
a substrate comprising a first material; and an alignment mark, disposed on said substrate, comprising a second material different from the first material; wherein the first material and the second material have transmittivities to at least light in a part of wavelength range of ultraviolet light, and wherein the second material has a refractive index of not less than 1.7.
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