US2014117574A1PendingUtilityA1
Strain and Kinetics Control During Separation Phase of Imprint Process
Est. expiryOct 24, 2028(~2.2 yrs left)· nominal 20-yr term from priority
Inventors:Niyaz KhusnatdinovFrank Y. XuMario Johannes MeisslMichael Nevin MillerEcron D. ThompsonGerard SchmidPawan Kumar NimmakayalaXiaoming LuByung-Jin Choi
B82Y 10/00B29C 37/0003G03F 7/0002B82Y 40/00
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Claims
Abstract
Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of separating an imprint lithography template from a solidified patterned layer formed on a substrate, the method comprising:
applying, by a chuck connected to the template, pressure to the template; applying, by an imprint head connected to the chuck; a force normal to the solidified layer to initiate separation of the template from the solidified layer; controlling the force applied by the imprint head and pressure applied by the chuck, wherein such controlling limits lateral displacement of the template with respect to the substrate.
2 . The method of claim 1 further comprising applying a predetermined pressure to the template prior to initiating separation.
3 . The method of claim 1 further comprising applying partial vacuum pressure to the template.
4 . The method of claim 1 wherein shearing stress on patterned layer features is minimized during separation.Join the waitlist — get patent alerts
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