US2014116671A1PendingUtilityA1
Heat sink assembly
Est. expiryOct 26, 2032(~6.2 yrs left)· nominal 20-yr term from priority
Inventors:Chun-Sheng Yu
H10W 40/037H10W 40/22H10W 40/25F28D 2021/0029F28F 3/06F28F 2275/22F28F 3/00
44
PatentIndex Score
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Claims
Abstract
A heat sink assembly includes a heat sink. The heat sink includes a base. The base defines a hermetic space. The base includes a panel body and a plurality of magnetic posts extending from the panel body. The plurality of magnetic posts are located in the hermetic space.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat sink assembly, comprising a heat sink, the heat sink comprises a base; the base defines a hermetic space; the base comprises a panel body and a plurality of magnetic posts extending from the panel body; and the plurality of magnetic posts are located in the hermetic space.
2 . The heat sink assembly of claim 1 , wherein the base further comprises a plurality of protrusions extending from the panel body; the plurality of protrusions are located in the hermetic space and surrounded by the plurality of magnetic posts.
3 . The heat sink assembly of claim 1 , wherein the heat sink further comprises a plurality of fins extending from the base, and the plurality of fins are substantially parallel to each other.
4 . The heat sink assembly of claim 1 , further comprising a printed circuit board and a supporting frame, wherein the printed circuit board comprises a board body and a heat generating element mounted to the board body; the supporting frame is mounted on the board body; the supporting frame defines an opening; the heat generating element is located in the opening; the base is mounted on the supporting frame; and the panel body contacts the heat generating element.
5 . The heat sink assembly of claim 4 , wherein the supporting frame comprises a supporting frame body; the supporting frame body comprises a support portion surrounding the opening; the support portion is substantially parallel to the board body; and the base is placed on the support portion.
6 . The heat sink assembly of claim 5 , wherein the supporting frame body further comprises a flange extending from the support portion; the flange surrounds the base; the flange is configured to prevent the base from moving along a direction substantially parallel to the board body.
7 . The heat sink assembly of claim 6 , wherein cross sections of the support portion and the flange are L-shaped taken along a plane substantially parallel to the board body.
8 . The heat sink assembly of claim 4 , wherein the supporting frame comprises a supporting frame body and a plurality of securing portions extending from the supporting frame body; the opening is defined in the supporting frame body; and the board body defines a plurality of securing holes receiving the plurality of securing portions.
9 . A heat sink assembly, comprising:
a printed circuit board, the printed circuit board comprises a board body and a heat generating element mounted to the board body; a supporting frame mounted to the board body, the supporting frame is made of metal; a heat sink, the heat sink comprises a base placed on the supporting frame and contacting the heat generating element; the base defines a hermetic space; the base comprises a plurality of protrusions and a plurality of magnetic posts are located in the hermetic space; and the base absorbs the supporting frame via magnetic force.
10 . The heat sink assembly of claim 9 , wherein the plurality of protrusions are surrounded by the plurality of magnetic posts.
11 . The heat sink assembly of claim 9 , wherein the heat sink further comprises a plurality of fins extending from the base, and the plurality of fins are substantially parallel to each other.
12 . The heat sink assembly of claim 9 , wherein the supporting frame defines an opening; the heat generating element is located in the opening.
13 . The heat sink assembly of claim 12 , wherein the supporting frame comprises a supporting frame body; the supporting frame body comprises a support portion surrounding the opening; the support portion is substantially parallel to the board body; and the base is placed on the support portion.
14 . The heat sink assembly of claim 13 , wherein the supporting frame body further comprises a flange extending from the support portion; the flange surrounds the base; the flange is configured to prevent the base from moving along a direction substantially parallel to the board body.
15 . The heat sink assembly of claim 14 , wherein cross sections of the support portion and the flange are L-shaped taken along a plane substantially parallel to the board body.
16 . The heat sink assembly of claim 12 , wherein the supporting frame comprises a supporting frame body and a plurality of securing portions extending from the supporting frame body; the opening is defined in the supporting frame body; and the board body defines a plurality of securing holes receiving the plurality of securing portions.Join the waitlist — get patent alerts
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