US2014116670A1PendingUtilityA1

Heat sink and cooling system including the same

Assignee: SAMSUNG ELECTRO MECHPriority: Oct 29, 2012Filed: Jan 7, 2013Published: May 1, 2014
Est. expiryOct 29, 2032(~6.3 yrs left)· nominal 20-yr term from priority
H10W 40/228H10W 40/226H10W 40/47H10W 40/43H10W 40/10F28D 2021/0029F28F 3/022H05K 7/20
42
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Claims

Abstract

Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A heat sink comprising:
 a heat radiation pattern member having at least one bend cross section; and   a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof.   
     
     
         2 . The heat sink as set forth in  claim 1 , wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections. 
     
     
         3 . The heat sink as set forth in  claim 2 , wherein the wire patterns have a polygonal cross section and are bonded in plural to the upper surface of the heat radiation plate. 
     
     
         4 . The heat sink as set forth in  claim 2 , wherein the mesh bend pattern has a wedge shaped cross section or an M shaped cross section and is bonded to the upper surface of the heat radiation plate. 
     
     
         5 . The heat sink as set forth in  claim 1 , wherein the heat radiation plate is mounted at one side of a heat radiation target through a thermal conductive paste provided on a lower surface thereof. 
     
     
         6 . The heat sink as set forth in  claim 1 , wherein the heat radiation pattern member is bonded to the upper surface of the heat radiation plate by any one bonding method of a diffusion bonding method, a welding method, and a soldering method. 
     
     
         7 . A cooling system comprising:
 a heat sink including a heat radiation pattern member having at least one bend cross section and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof and mounted on a heat radiation target;   an injecting part coupled to and sealed by the heat sink and having cooling air or cooling water passing therethrough and flowing therein; and   a controlling unit connected to the heat sink and controlling cooling using the heat sink and the injecting unit.   
     
     
         8 . The cooling system as set forth in  claim 7 , wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections. 
     
     
         9 . The cooling system as set forth in  claim 8 , wherein the wire patterns have a polygonal cross section and are bonded in plural to the upper surface of the heat radiation plate. 
     
     
         10 . The cooling system as set forth in  claim 8 , wherein the mesh bend pattern has a wedge shaped cross section or an M shaped cross section and is bonded to the upper surface of the heat radiation plate. 
     
     
         11 . The cooling system as set forth in  claim 7 , wherein the injecting part receives the cooling air or the cooling water supplied from a pump connected to the controlling unit. 
     
     
         12 . The cooling system as set forth in  claim 11 , further comprising a temperature sensing sensor provided at one side of the heat sink,
 wherein the controlling unit controls a flow amount or flow velocity of the cooling air or the cooling water supplied by the pump using temperature information detected by the temperature sensing sensor.

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