US2014116670A1PendingUtilityA1
Heat sink and cooling system including the same
Est. expiryOct 29, 2032(~6.3 yrs left)· nominal 20-yr term from priority
H10W 40/228H10W 40/226H10W 40/47H10W 40/43H10W 40/10F28D 2021/0029F28F 3/022H05K 7/20
42
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Claims
Abstract
Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat sink comprising:
a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof.
2 . The heat sink as set forth in claim 1 , wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.
3 . The heat sink as set forth in claim 2 , wherein the wire patterns have a polygonal cross section and are bonded in plural to the upper surface of the heat radiation plate.
4 . The heat sink as set forth in claim 2 , wherein the mesh bend pattern has a wedge shaped cross section or an M shaped cross section and is bonded to the upper surface of the heat radiation plate.
5 . The heat sink as set forth in claim 1 , wherein the heat radiation plate is mounted at one side of a heat radiation target through a thermal conductive paste provided on a lower surface thereof.
6 . The heat sink as set forth in claim 1 , wherein the heat radiation pattern member is bonded to the upper surface of the heat radiation plate by any one bonding method of a diffusion bonding method, a welding method, and a soldering method.
7 . A cooling system comprising:
a heat sink including a heat radiation pattern member having at least one bend cross section and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof and mounted on a heat radiation target; an injecting part coupled to and sealed by the heat sink and having cooling air or cooling water passing therethrough and flowing therein; and a controlling unit connected to the heat sink and controlling cooling using the heat sink and the injecting unit.
8 . The cooling system as set forth in claim 7 , wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.
9 . The cooling system as set forth in claim 8 , wherein the wire patterns have a polygonal cross section and are bonded in plural to the upper surface of the heat radiation plate.
10 . The cooling system as set forth in claim 8 , wherein the mesh bend pattern has a wedge shaped cross section or an M shaped cross section and is bonded to the upper surface of the heat radiation plate.
11 . The cooling system as set forth in claim 7 , wherein the injecting part receives the cooling air or the cooling water supplied from a pump connected to the controlling unit.
12 . The cooling system as set forth in claim 11 , further comprising a temperature sensing sensor provided at one side of the heat sink,
wherein the controlling unit controls a flow amount or flow velocity of the cooling air or the cooling water supplied by the pump using temperature information detected by the temperature sensing sensor.Join the waitlist — get patent alerts
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