Loop thermosyphon cooling device

Abstract

A loop thermosyphon cooling device includes an evaporator, a condenser and a communication assembly. The evaporator includes a heat conducting element and evaporation pipes, and the heat conducting element has through holes, and each evaporation pipe is passed and positioned into each respective through hole. The condenser includes a condensation pipe. The communication assembly includes a first barrel and a second barrel, and both ends of each evaporation pipe are communicated with the first and second barrels, and both ends of the condensation pipe are communicated with the first and second barrels, so that the evaporation pipe, condensation pipe, first barrel and second barrel jointly define a loop. A communication assembly is coupled between the evaporation pipe and the condensation pipe, and the quantity of evaporation pipes and condensation pipes can be increased or decreased as needed, and the thermosyphon cooling device is compact and high heat dissipation efficiency.

What is claimed is: 
     
         1 . A loop thermosyphon cooling device, comprising:
 an evaporator, including a heat conducting element and a plurality of evaporation pipes, and the heat conducting element having a plurality of through holes, and each evaporation pipe being passed and positioned into each corresponding through hole;   a condenser, including a condensation pipe; and   a communication assembly, including a first barrel and a second barrel, and both ends of each evaporation pipe being communicated with the first barrel and the second barrel respectively, and both ends of the condensation pipe being communicated with the first barrel and the second barrel respectively, so that each of the evaporation pipes, the condensation pipe, the first barrel and the second barrel jointly form a loop.   
     
     
         2 . The loop thermosyphon cooling device of  claim 1 , wherein the heat conducting element has a heated surface and a placing surface opposite to each other, and each through hole has a through opening of the placing surface, and each evaporation pipe is partially exposed from the placing surface through each through opening. 
     
     
         3 . The loop thermosyphon cooling device of  claim 1 , wherein the heat conducting element has a heated surface, and each through hole has a through opening formed on the heated surface, and each evaporation pipe has a plane exposed from each through opening, and each plane and the heated surface are aligned evenly with each other. 
     
     
         4 . The loop thermosyphon cooling device of  claim 1 , further comprising a working fluid circulating in the loop, and both ends of each evaporation pipe having a liquid inlet end and a gas outlet end respectively, and each liquid inlet end being communicated with the first barrel, and each gas outlet end being communicated with the second barrel, and the heat conducting element having a heated surface, and the second barrel and the heated surface having a height difference greater than the height difference between the first barrel and the heated surface, and the first barrel is a liquid storage barrel, and the second barrel is a gas storage barrel. 
     
     
         5 . The loop thermosyphon cooling device of  claim 4  wherein the working fluid is water or a coolant. 
     
     
         6 . The loop thermosyphon cooling device of  claim 4 , wherein the condenser further comprises a plurality of fins, and the communication assembly further comprises a third barrel, and the condensation pipe comprises a plurality of first condensation pipes and at least one second condensation pipe, and both ends of each first condensation pipe has a gas inlet end and a liquid outlet end, and both ends of the second condensation pipe have a liquid filling end and a liquid discharging end respectively, and each fin is fixed to the first condensation pipes, and each gas inlet end is communicated with the second barrel, and each liquid outlet end is communicated with the third barrel, and the liquid filling end is communicated with the third barrel, and the liquid discharging end is communicated with the first barrel, and the third barrel is a liquid storage barrel. 
     
     
         7 . The loop thermosyphon cooling device of  claim 6 , wherein each first condensation pipe is tilted gradually from the gas inlet end to the liquid outlet end in a direction of approaching the heat conducting element. 
     
     
         8 . The loop thermosyphon cooling device of  claim 6 , wherein the second condensation pipe has a necking portion formed at a position near the first barrel. 
     
     
         9 . The loop thermosyphon cooling device of  claim 4 , wherein the condenser further includes a plurality of fins, and the communication assembly further includes a third barrel and a fourth barrel, and the condensation pipe includes a plurality of first condensation pipes, at least one second condensation pipe and at least one diversion assisting pipe, and both ends of each first condensation pipe have a gas inlet end and a liquid outlet end respectively, and both ends of the second condensation pipe have a liquid filling end and a liquid discharging end respectively, and both ends of the diversion assisting pipe have a gas filling end and a gas outlet end respectively, and each fin is fixed to the first condensation pipes, and the gas filling end is communicated with the second barrel, and the gas outlet end is communicated with the fourth barrel, and each gas inlet end is communicated with the fourth barrel, and each liquid outlet end is communicated with the third barrel, and the liquid filling end is communicated with the third barrel, and the liquid discharging end is communicated with the first barrel, and the third barrel is a liquid storage barrel, and the fourth barrel is a gas storage barrel. 
     
     
         10 . The loop thermosyphon cooling device of  claim 9 , wherein each first condensation pipe is tilted gradually from the gas inlet end to the liquid outlet end in a direction approaching the heat conducting element. 
     
     
         11 . The loop thermosyphon cooling device of  claim 9 , wherein the second condensation pipe has a necking portion formed at a position near the first barrel. 
     
     
         12 . The loop thermosyphon cooling device of  claim 4 , wherein the condenser further includes a plurality of fins, and the condensation pipe includes a condensation pipe, and both ends of the condensation pipe have a liquid guiding end and a gas guiding end respectively, and the liquid guiding end is communicated with the first barrel, and the gas guiding end is communicated with the second barrel, and the condensation pipe has at least one U-shaped section bent from the condensation pipe, and the fins are fixed to the U-shaped section. 
     
     
         13 . The loop thermosyphon cooling device of  claim 12 , wherein the condensation pipe has an extension from at the gas guiding end and away from the heat conducting element, and the extension has an end, and the condensation pipe has the U-shaped section extended from the end, and the U-shaped section is tilted gradually from the end in a direction approaching the heat conducting element. 
     
     
         14 . The loop thermosyphon cooling device of  claim 12 , wherein the condensation pipe has a necking portion formed at a position near the first barrel.