Heat sink applicable for eletromagnetic device

Abstract

The present disclosure provides a heat sink applicable for electromagnetic device comprises a first panel, a second panel, and a plurality of supporting structures connecting with the first panel and the second panel. Wherein the first panel, the second panel and the supporting structures together constitute a plurality of medium channels for cooling medium flowing therethrough. Wherein at least some of the medium channels are provided with openings formed on the first and/or second panels, and no close conductive loop is formed on cross section perpendicular to a medium flowing direction of the medium channels with the openings. Wherein a total area of all openings on the first panel is less than 50% of an area of the first panel, a total area of all openings on the second panel is less than 50% of an area of the second panel.

What is claimed is: 
     
         1 . A heat sink applicable for electromagnetic device comprising
 a first panel,   a second panel, and   a plurality of supporting structures connecting with the first panel and the second panel,   wherein the first panel, the second panel and the supporting structures together constitute a plurality of medium channels for cooling medium flowing therethrough,   wherein at least some of the medium channels are provided with openings formed on the first and/or second panels, and no close conductive loop is formed on cross section perpendicular to a cooling medium flowing direction of the medium channels with the openings, and   wherein a total area of all openings on the first panel is less than 50% of an area of the first panel, a total area of all openings on the second panel is less than 50% of an area of the second panel.   
     
     
         2 . The heat sink according to  claim 1 , wherein each medium channel is provided with an opening, the openings on the first panel alternate with those on the second panel. 
     
     
         3 . The heat sink according to  claim 1 , wherein each medium channel is provided with an opening, all of the openings are defined on the first panel or on the second panel. 
     
     
         4 . The heat sink according to  claim 1 , wherein the first panel is parallel to the second panel. 
     
     
         5 . The heat sink according to  claim 4 , wherein the first panel and the second panel are flat-shaped or arc-plate-shaped. 
     
     
         6 . The heat sink according to  claim 1 , wherein the first panel, the second panel and the supporting structures are made of metal material. 
     
     
         7 . The heat sink according to  claim 1  wherein the cross section of the medium channel has a rectangular shape, a triangular shape, a trapezoidal shape, a circular shape or an oval shape. 
     
     
         8 . The heat sink according to  claim 1 , wherein at least some of the medium channels are provided with at least one fin. 
     
     
         9 . The heat sink according to  claim 8 , wherein the fin is parallel to the medium channel or has a spiral form. 
     
     
         10 . The heat sink according to  claim 1 , wherein at least one of the openings is provided with an insulating seal. 
     
     
         11 . A heat sink applicable for electromagnetic device comprising
 a first panel,   a second panel,   a middle substrate between the first panel and the second panel, and   a plurality of supporting structures connecting with the first panel and the middle substrate and connecting with the second panel and the middle substrate respectively,   wherein the first panel and the middle substrate and the supporting structures together with the second panel and the middle substrate and the supporting structures constitute two layers of multiple medium channels for cooling medium flowing therethrough,   wherein at least some of the medium channels are provided with openings formed on the first and/or second panels, and no close conductive loop is formed on a cross section perpendicular to cooling medium flowing direction of the medium channels with the openings, and   a total area of all openings on the first panel is less than 50% of an area of the first panel, a total area of all openings on the second panel is less than 50% of an area of the second panel.   
     
     
         12 . The heat sink according to  claim 11 , wherein the opening is defined on each medium channel, the openings defined on the first panel correspond to or alternate with those on the second panel. 
     
     
         13 . The heat sink according to  claim 11 , wherein the first panel, the second panel and the middle substrate are parallel to each other. 
     
     
         14 . The heat sink according to  claim 13 , wherein the first panel, the second panel and the middle substrate are flat-shaped or arc-plate-shaped. 
     
     
         15 . The heat sink according to  claim 11 , wherein the first panel, the second panel, the middle substrate and the supporting structures are made of metal material. 
     
     
         16 . The heat sink according to  claim 11 , wherein the cross section of the medium channel has a rectangular shape, a triangular shape, a trapezoidal shape, a circular shape or an oval shape. 
     
     
         17 . The heat sink according to  claim 11 , wherein at least some of the medium channels are provided with at least one fin. 
     
     
         18 . The heat sink according to  claim 17 , wherein the fin is parallel to the medium channel or has a spiral form. 
     
     
         19 . The heat sink according to  claims 11 , wherein at least one of the openings is provided with an insulating seal.